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AI Technology UVR 500

Product Type: Dicing Tape

Application Area: Wafer Bonding

Compatible Substrates & Surfaces: Ceramic, Glass

Features: Anti-Static, Good Adhesion, Good Peeling Strength, UV-release

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Knowde Enhanced TDS

Identification & Functionality

Backing Material Type
Product Type

Features & Benefits

Labeling Claims

Applications & Uses

Application Area
Compatible Substrates & Surfaces

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Peel Strength500g/inch
Peel Strength (After UV Exposure, Adjustable)20g/inch
Adhesive Thickness25microns
Substrate Thickness75microns
Elongation100%
Tensile Strengthmin. 200Kg/cm

Regulatory & Compliance

Certifications & Compliance