Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
Applications & Uses
- Markets
Properties
- Typical Properties
Value | Units | Test Method / Conditions | |
Electrical Resistivity | min. 10¹⁴ | Ω-cm | — |
Dielectric Strength | min. 750 | Volts/mil | — |
Optical Clarity (Transmission at 100 micron thickness) | min. 95 | % | — |
Peel Strength (Cohesive Failure, with EVA) | min. 10 | lbs/inch | — |
Device Push Off Strength (on Glass, Silicon) | min. 1200 | psi | — |
Cured Density (for Composite Dielectric) | 1.65 | g/cc | — |
Thermal Conductivity | min. 0.2 | W/m-°C | — |
Coefficient of Linear Thermal Expansion (X-Y=Z, Isotropic) | 90 | ppm/°C | — |
Elastic Modulus | 20000 | psi | — |
Elongation Before Breakage | 300 | % | — |
Recommended Melt Lamination Pressure | min. 15 | psi | — |
Maximum Continuous Operation Temperature | min. 150 | °C | — |
Recommended Melt Lamination Temperature | min. 150 | °C | — |
Recommended Melt Lamination Time | min. 0.5 | seconds | — |
Regulatory & Compliance
- Certifications & Compliance