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Aquabond™ 55 has the lowest melting and bonding temperature and is generally used for lapping, back grinding, wafer bonding and wafer thinning. It puddles quickly and can spread as thin as four (4) microns.

Product Type: Adhesive

Application Area: Wafer Bonding, Wafer Thinning

    Knowde Enhanced TDS

    Identification & Functionality

    Product Type

    Features & Benefits

    Features
    • Chemical Specific Solubility
    • Water Soluble
    • Superior Adhesion Strength
    • Structural Stability
    • Process Selectivity
    • Broad Range of Bonding Temperatures (90-150C)
    • Convenient Application (Stick or Bulk Ingots)
    • Quick Preparation Time
    • Eliminates or Reduces Blade Dressing
    • Consistent, Stable Slicing
    • Film Virtually Prevents Chatter During Machining
    • Bonds Are Rigid But Not Brittle
    • Safe, Easy Removal of Finished Parts
    • Environmentally Friendly and Worker Safe
    • Hazardous Materials, Including Solvents, Are No Longer Needed
    • Heat And Agitation Easily Improve Debonding Times
    • Superior Performance

    Applications & Uses