Products

Aquabond™ 55 has the lowest melting and bonding temperature and is generally used for lapping, back grinding, wafer bonding and wafer thinning. It puddles quickly and can spread as thin as four (4) microns.

Aquabond™ 65 is a formulation with the properties of both Aquabond 55™ and Aquabond 85™. It is a great all purpose product for either lapping and grinding or slicing and dicing.

Aquabond™ 85 has the highest melting and bonding temperature and is used as a backfill for bonding parts that are not flat. It is also used for grooving, cutting, slicing and dicing hard, single crystal materials. This product has higher tensile strength than other thermoplastics without being brittle.