Products

55NT is an epoxy laminate and prepreg system, reinforced with a non-woven aramid substrate. This system combines compatibility with lead-free processing, using a hightemperature epoxy resin, with the low in-plane (x,y) expansion and outstanding dimensional stability of non-woven aramid reinforcement.

Arlon 45N is a tough, high Tg (175°C by DSC) multifunctional epoxy laminate and prepreg system designed for use in a variety of higher layer count MLB's. Processeable using conventional FR-4 conditions, 45N is supplied to meet the requirements of IPC-4101/24.

47N is a low-flow epoxy prepreg engineered for binding multilayer epoxy rigid-flex or attaching heatsinks to multilayer PCBs. An optional low lamination temperature protects components already mounted on the PCB.

Arlon 44N is a high resin content multifunctional (175°C) epoxy prepreg system with a proprietary micordisperse ceramic filler system. 44N is engineered for the filling of clearance holes in thin Metal cores such as 0.006" Copperinvar- Copper or via holes in sequentially laminated MLB designs. Based on Arlon's 45N, the 44N system is compatible with conventional epoxy lamination and fabrication.

45NK is a woven Kevlar® aramid fiber reinforced multifunctional epoxy laminate and prepreg systemengineered to provide in-plane CTE values as low as 6 ppm/°C for compatibility with leadless alumina ceramic chip carriers (LCCC's) and other low expansion SMT devices where control of laminate expansion is critical for solder joint reliability. 45NK exceeds the requirements of IPC 4101/50 (Type AFG).

55LM is an epoxy laminate and prepreg system, reinforced with non-woven aramid fiber, with substantially lower moisture absorption compared with conventional epoxy/aramid products, even in high-humidity environments.