Products

Bondline 6570 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Bondline 6576 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Bondline 6571 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.

Bondline 7780 is a medium viscosity epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, or lid sealing adhesive

Bondline 7784 is a medium viscosity, one component, thermally conductive epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, heat sink attach, lid sealing and component staking adhesive. It exhibits strong adhesion to difficult-to-bond metals, such as gold, silver, and copper.

Bondline 6577 is a medium viscosity epoxy adhesive that can be cured at room temperature. Used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock resistant properties.