Golpanol

Golpanol® MBS Granules N, serving as a corrosion inhibitor, is applicable in nickel electroplating and electroplating processes. In a solid physical form, it contributes to corrosion protection in industrial applications.

Golpanol® VS is mainly useful for electroplating nickel and other metals, as well as for industrial applications. Golpanol® VS is available in the liquid form and it is utilized in metal the manufacturing and finishing applications, specifically in nickel electroplating.

Golpanol® ALS is a sodium allylsulphonate, that plays a crucial role as an electroplating additive, particularly in nickel and other metal plating processes. It serves to improve throwing power, ductility, and brightness during electroplating. This versatile additive is extensively employed in medium-acid metal plating and serves various functions, acting as a basic brightener, leveler, and polarization agent, contributing to the effectiveness of the electroplating process.

Golpanol® BOZ is a crystalline compound derived from 2-butyne-1,4-diol. It is frequently employed as an electroplating additive, particularly as a top brightener in metal plating processes, notably for metals such as nickel. Its key role involves enhancing the throwing power, ductility, and overall brightness of the plated metal, contributing to the efficiency and quality of the electroplating process.

Golpanol® HD is an electroplating additive containing 3-hexyne-2,5-diol, an acetylenic-based compound. It is recognized for its resource-efficient properties and its role in enhancing the brightness of semibright nickel coatings. This additive serves as a basic brightener in the electroplating process, primarily for nickel and other medium-acidic metals.