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Cast-Coat Inc. CC3-301AD

Cast-Coat Inc. CC3-301AD is a low viscosity version of CC3-301. It offers the same excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices, it distributes heat evenly throughout the casting, providing greater efficiency and a longer working life. This compound has good wetting properties and low surface tension. It’s high fluidity and good air release recommend it for potting intricate circuitry. Glass diodes potted in CC3-301AD have shown good resistance to cracking under severe temperature cycling. Unlike CC3-301, the filler used in CC3-301AD may settle out during storage. It is very important to stir the material in it’s shipping container prior to use.

Product Type: Potting Compound

Application Area: Amplifiers, Integrated Circuits, Oscillators, Power Transformers, Relays, Semiconductors

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Applications & Uses

Typical Applications

Densely packed power supplies, integrated circuits, thick film hybrid devices, D/A converters, delay lines, oscillators, minidac, operational amplifiers, binary devices, relays, transformers and semiconductors.

Room Temperature Cure
  • H-1 Hardener: Cures overnight at room temperature or 2 hours at 65°C. Do not heat cure if the mass exceeds 200 grams.
  • H-18 Hardener: Cures overnight at room temperature or 2 hours at 65°C. Do not heat cure if the mass exceeds 200 grams.
Mixing Instructions

Mix CC3-301AD thoroughly in it’s shipping container to insure a uniform consistency. Weigh out the desired amount of resin in a clean container. Add the hardener accurately by weight in the proper proportion as specified above. (ie. 5.4 grams of H-1 Hardener and 100 grams of CC3-301AD for a total mix of 105.4 grams) Mix thoroughly. Use in a well ventilated area and avoid contact with eyes and skin.

Properties

Color
Physical & Electrical Properties
ValueUnitsTest Method / Conditions
Coefficient of Thermal Expansion28 x 10^(-6)in/in/’C
Compressive Strength (25°C)19000.0psi
Dielectric Constant (25°C, 100 KC)5.6
Dielectric Strength600.0volts/mil
Dissapation Factor (25°C, 100 KC)0.02
Heat Distortion65.0°C
Izod Impact (of Notch)0.49ft lbs/in
Linear Shrinkage0.003in/in
Service Temperature (Continuous)-65 - 150°C
Specific Gravity (Catalyzed, 25°C)1.76
Specific Gravity (Uncatalyzed, 25°C)1.95
Tensile Strength (25°C)7800.0psi
Thermal Conductivity1.25W/mK
Viscosity (Catalyzed, 22.5°C)1160.0cps
Viscosity (Uncatalyzed, 22.5°C)7400.0cps
Volume Resistivity (25°C)1015.0ohm-cm
Water Absorption (7 days, 25°C)0.3%

Regulatory & Compliance

Regulations

CC3-301AD meets MIL T-27, Grade 5, Class S; MIL STD. 202.111, FED TEST METHOD STD. 406-2021; and MIL I-16923, Types C and D.

Technical Details & Test Data

Choice of Hardeners
  • H-1 Hardener: Rigid, good dimensional stability, fast cure.
  • H-18 Hardener: Resilient, excellent mechanical and thermal shock, low viscosity, good air release, fast cure.
HARDENER PARTS BY WEIGHT PER 100 PARTS OF RESIN POT LIFE 100 GRAM 25°C (77°F) CURE TIME 25°C (77°F) CURE TIME 65°C (149°F)

CURE TIME 125°C (257°F)

H-1 Hardener 5.4 2 hrs. 24 hrs. 2 hrs. - - -
H-18 Hardener 11 3 hrs. 24 hrs. 2 hrs. - - -