Products

Cast-Coat Inc. CC3-301AD is a low viscosity version of CC3-301. It offers the same excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices, it distributes heat evenly throughout the casting, providing greater efficiency and a longer working life. This compound has good wetting properties and low surface tension. It’s high fluidity and good air release recommend it for potting intricate circuitry. Glass diodes potted in CC3-301AD have shown good resistance to cracking under severe temperature cycling. Unlike CC3-301, the filler used in CC3-301AD may settle out during storage. It is very important to stir the material in it’s shipping container prior to use.

Cast-Coat Inc. CC3-341 was developed as a thin glue line adhesive to be used in bonding high wattage semiconductor mounting blocks to heatsinks. Being thermally conductive and electrically insulating, CC3-341 exhibits the unique capability of providing an excellent heat path between a power device and heatsink while insuring maximum electrical isolation. Glue lines as thin as 0.001” can be easily achieved while still maintaining a strong bond over a wide temperature range of -65°C to 155°C. When cured, CC3-341 is not adversely affected by moisture, humidity or salt spray, and will withstand repeated cycling through a wave solder machine.

Cast-Coat Inc. CC3-465 was developed for the semiconductor industry as a light weight, low dielectric constant epoxy potting compound. Its low viscosity and good wetting properties enable densely packaged circuitry to be totally encapsulated, void free without the aid of a vacuum in most cases. The hollow glass microspheres increase its structural strength and electrical insulation while reducing shrinkage and thermal conductivity. CC3-465 is easy to use and is readily adaptable to automatic machine dispensing. It cures at room temperature or with heat and meets most military and UL flame retardant requirements.

Cast-Coat Inc. CC3-301ADFR is a fire retardant version of CC3-301AD. It offers the same excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices, it distributes heat evenly throughout the casting, providing greater efficiency and a longer working life. This compound has good wetting properties and low surface tension. It’s high fluidity and good air release recommend it for potting intricate circuitry. Glass diodes potted in CC3-301AD-FR have shown good resistance to cracking under severe temperature cycling. The filler used in CC3-301AD-FR may settle out during storage. It is very important to stir the material in it’s shipping container prior to use.

Cast-Coat Inc. CC3-301AD-FR Flex-12 is a fire retardant version of CC3-301AD. It offers the same excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range. As an encapsulant for power devices, it distributes heat evenly throughout the casting, providing greater efficiency and a longer working life. This compound has good wetting properties and low surface tension. It’s high fluidity and good air release recommend it for potting intricate circuitry. Glass diodes potted in CC3-301AD-FR Flex-12 have shown good resistance to cracking under severe temperature cycling. The filler used in CC3-301AD-FR Flex-12 may settle out during storage. It is very important to stir the material in it’s shipping container prior to use.