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Cast-Coat Inc. CC3-341

Cast-Coat Inc. CC3-341 was developed as a thin glue line adhesive to be used in bonding high wattage semiconductor mounting blocks to heatsinks. Being thermally conductive and electrically insulating, CC3-341 exhibits the unique capability of providing an excellent heat path between a power device and heatsink while insuring maximum electrical isolation. Glue lines as thin as 0.001” can be easily achieved while still maintaining a strong bond over a wide temperature range of -65°C to 155°C. When cured, CC3-341 is not adversely affected by moisture, humidity or salt spray, and will withstand repeated cycling through a wave solder machine.

Product Type: Conductive Adhesive

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Room Temperature Cure
  • H-1 Hardener: Cures overnight at room temperature or 2 hrs at 65°C. Do not heat cure if the mass exceeds 200 grams.
  • H-18 Hardener: Cures overnight at room temperature or 2 hrs at 65°C.
  • H-10LV Hardener: Cures overnight at room temperature or 3 hrs at 65°C.
Mixing Instructions

Mix CC3-341 thoroughly in it’s shipping container to insure a uniform consistency. Weigh out the desired amount of resin in a clean container. Add the hardener accurately by weight in the proper proportion as specified above. (ie. 6.4 grams of H-1 Hardener and 100 grams of CC3-341 for a total mix of 106.4 grams) Mix thoroughly. Evacuate the mix in order to insure a void free glue line. Apply to both mating surfaces. Work the surfaces together, squeezing out the excess adhesive in order to obtain a thin bond line. The parts should be held securely in place with moderate pressure to prevent movement during cure.

Properties

Physical & Electrical Properties
ValueUnitsTest Method / Conditions
Bond Shear Strength (Al to Al 1” Overlap, 25°C)3840.0psi
Coefficient of Thermal Expansion26 x 10^(-6)in/in/’C
Compressive Strength (25°C)23400.0psi
Dielectric Constant (25°C, 100 KC)5.7
Dielectric Strength300 - 350volts/mil
Dissapation Factor (25°C, 100 KC)0.02
Hardness84 - 88Shore D
Heat Distortion145.0°C
Izod Impact (of Notch)0.25ft lbs/in
Linear Shrinkage0.0025in/in
Service Temperature (Continuous)-65 - 125°C
Service Temperature (Intermittent)-100 - 160°C
Specific Gravity (Catalyzed, 25°C)1.7
Specific Gravity (Uncatalyzed, 25°C)1.74
Tensile Elongation (Yield)1.7 - 1.9%
Tensile Strength (25°C)8298.0psi
Thermal Conductivity1.1W/mK
Thermal Resistance35.6°C in/watt
Viscosity (Catalyzed, 22.5°C)4100.0cps
Viscosity (Uncatalyzed, 22.5°C)9500.0cps
Volume Resistivity (25°C)1016.0ohm-cm
Water Absorption (10 days, 25°C)0.2%

Technical Details & Test Data

Choice of Hardeners
  • H-1 Hardener: Rigid, good dimensional stability, fast cure.
  • H-18 Hardener: Resilient, excellent mechanical and thermal shock, low viscosity, good air release, fast cure.
  • H-10LV Hardener: Variable hardness, excellent impact properties, long pot life
HARDENER PARTS BY WEIGHT PER 100 PARTS OF RESIN POT LIFE 100 GRAM 25°C (77°F) CURE TIME 25°C (77°F) CURE TIME 65°C (149°F)

CURE TIME 125°C (257°F)

H-1 Hardener 6.4 2 hrs. 24 hrs. 2 hrs. - - -
H-18 Hardener 13.3 3 hrs. 24 hrs. 2 hrs. - - -
H-10LV Hardener 15 (rigid) 3 hrs. 24 hrs. 3 hrs. - - -
H-10LV Hardener 40 (semi-flex) 3 hrs. 24 hrs. 3 hrs. - - -
H-10LV Hardener 62 (flexible) 3 hrs. 24 hrs. 3 hrs. - - -

Storage & Handling

Shelf Life
12 Months