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Cast-Coat Inc. CC3-465

Cast-Coat Inc. CC3-465 was developed for the semiconductor industry as a light weight, low dielectric constant epoxy potting compound. Its low viscosity and good wetting properties enable densely packaged circuitry to be totally encapsulated, void free without the aid of a vacuum in most cases. The hollow glass microspheres increase its structural strength and electrical insulation while reducing shrinkage and thermal conductivity. CC3-465 is easy to use and is readily adaptable to automatic machine dispensing. It cures at room temperature or with heat and meets most military and UL flame retardant requirements.

Product Type: Potting Compound

Application Area: Semiconductors

Cure Method: Air Dry, Heat Cure

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Applications & Uses

Application Area
Mixing Instructions

Stir CC3-465 in it’s shipping container to insure dispersion of filler. The use of power mixing equipment is recommended only if used at low speed to avoid breaking the glass bubble filler. Weigh out the desired amount of resin in a clean container. Add 22.5 parts of H-18 Hardener per 100 parts of CC3-465 by weight. (ie. 22.5 grams of H-18 Hardener and 100 grams of CC3-465 for a total mix of 122.5 grams) Mix thoroughly. Vacuum can be used to remove entrapped air prior to pouring. Use in a well ventilated area and avoid contact with eyes and skin.

Cure Schedule

When curing more than 100 grams of concentrated mass, allow to cure at room temperature. Quantities of less than 100 grams can be cured more rapidly with heat up to 150°C. Each application is different. It is advisable to run a sample through an oven at the temperature of your choice. Check to see how long it takes to harden and be sure the resin did not boil or exotherm before it cured.

Properties

Color
Physical Properties
ValueUnitsTest Method / Conditions
Compressive Strength (25°C)10300.0psi-
Hardness75 - 80Shore D-
Heat Distortion130.0°C-
Izod Impact (of Notch)0.21ft lbs/in-
Linear Shrinkage0.005in/in-
Service Temperature (Continuous)-65 - 130°C-
Service Temperature (Intermittent)-100 - 200°C-
Tensile Elongation (Yield)2.0 - 3.0%-
Tensile Strength (25°C)4545.0psi-
Water Absorption (7 days, 25°C)0.25%-
Thermal Properties
ValueUnitsTest Method / Conditions
Coefficient of Thermal Expansion39 x 10^(-6)in/in/’C-
Thermal Conductivity0.15W/mK-
Thermal Resistance248.0°C in/watt-
Typical Properties
ValueUnitsTest Method / Conditions
Specific Gravity (25°C)0.77--
Electrical Properties
ValueUnitsTest Method / Conditions
Dielectric Constant (25°C, 100 KC)1.9--
Dielectric Strength300 - 500volts/mil-
Dissapation Factor (25°C, 100 KC)0.003--
Volume Resistivity (25°C)1014.0ohm-cm-

Storage & Handling

Shelf Life
12 Months