- Compatible Polymers & Resins:Polystyrenes (PS), Polyethylenes (PE)
- Chemical Family:Epoxy & Epoxy Derivatives
HYTAC® W was CMT’s first commercially-produced epoxy syntactic foam. With low thermal conductivity and CTLE associated with the syntactic structure, it proved to the thermoforming industry that felt-covered wood plugs could be resigned to the dustbin of history. While still used in low-volume or low-cost applications, W has been supplanted by other, superior levels of HYTAC® materials. It has low thermal conductivity and specific heat, this translates to lower heat transfer reducing warm-up time and virtually eliminating material sticking to the plug. It is dimensionally stable which means, that the low coefficient of thermal expansion means the plug maintains its shape over a wide temperature range.