Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Fillers Included
- Polymer Name
- Plastics & Elastomers Functions
- Technologies
- Product Families
Features & Benefits
- Materials Features
- Key Features
D33 / 6120 has a low water absorption, high dielectric strength, and low dissipation factor along with a fast cure.
Applications & Uses
- Markets
- Applications
- Plastics & Elastomers End Uses
- Plastics & Elastomers Processing Methods
- Product Applications
Switches, terminals, insulators, cups, cases and other applications requiring strength. Also useful for encapsulation of electrical and electronic components. Has easy flow and is useful for molding thin parts..
Properties
- Mechanical Properties
- Thermal Properties
- Electrical Properties
- Moisture Properties
- Processing Information (Molding)
Value | Units | Test Method / Conditions | |
Flexural Strength | 13 - 15,000 | psi | — |
Compressive Strength | 24 - 26,000 | psi | — |
Tensile Strength | 6 - 10,000 | psi | — |
Impact Strength (Izod Notched) | 0.5 - 1.2 | ft-lb / inch | — |
Value | Units | Test Method / Conditions | |
Dimensional Stability | max. 0.01 | % | — |
Thermal Expansion (at -40 °C to 100 °C) | 1.2 | 10⁻⁵ / °C | — |
Heat Distortion Temperature (at 18.6 kg/cm²) | 260 | °C | — |
Value | Units | Test Method / Conditions | |
Arc Resistance | 145 | seconds | — |
Dielectric Strength (Kv Step-by-Step, Dry) | 380 | volts/mil | — |
Dielectric Strength (Kv Step-by-Step, Wet) | 340 | volts/mil | — |
Dielectric Breakdown (Step-by-Step, Dry) | 62 | Kv | — |
Dielectric Breakdown (Step-by-Step, Wet) | 60 | Kv | — |
Dielectric Constant (at 1 KHz, Dry) | 4.2 | — | — |
Dielectric Constant (at 1 KHz, Wet) | 4.3 | — | — |
Dissipation Factor (at 1KHz, Dry) | 0.007 | — | — |
Dissipation Factor (at 1KHz, Wet) | 0.011 | — | — |
Surface Resistance Megaohms (As is) | min. 10¹⁰ | — | — |
Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH) | 10⁴ | — | — |
Dielectric Constant (at 1 MHz, Dry) | 4 | — | — |
Dielectric Constant (at 1 MHz, Wet) | 4.2 | — | — |
Dissipation Factor (at 1MHz, Dry) | 0.013 | — | — |
Dissipation Factor (at 1MHz, Wet) | 0.015 | — | — |
Value | Units | Test Method / Conditions | |
Water Absorption (at 50 °C,48 hours) | 0.25 | % | — |
Value | Units | Test Method / Conditions | |
Specific Gravity | 1.72 | — | — |
Bulk Factor | 2.5 | — | — |
Molding Pressure | 500 - 8,000 | psi | — |
Molding Temperature | 135 - 190 | °C | — |
Mold Shrinkage | 0.001 - 0.004 | In / In | — |
Regulatory & Compliance
- Certifications & Compliance