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DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.

Polymer Name: Diallyl Phthalate

Processing Methods: Compression Molding, Injection Molding, Transfer Molding

End Uses: Cases, Cups, Encapsulant, Insulators, Switches, Terminal Blocks

Density: 1720.0 - 1720.0 kg/m³

Tensile Strength: 0.0414 - 69.0 MPa

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Identification & Functionality

Polymer Name
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features

D33 / 6120 has a low water absorption, high dielectric strength, and low dissipation factor along with a fast cure.

Applications & Uses

Plastics & Elastomers Processing Methods
Product Applications

Switches, terminals, insulators, cups, cases and other applications requiring strength. Also useful for encapsulation of electrical and electronic components. Has easy flow and is useful for molding thin parts..

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength13 - 15,000psi
Compressive Strength24 - 26,000psi
Tensile Strength6 - 10,000psi
Impact Strength (Izod Notched)0.5 - 1.2ft-lb / inch
Thermal Properties
ValueUnitsTest Method / Conditions
Dimensional Stabilitymax. 0.01%
Thermal Expansion (at -40 °C to 100 °C)1.210⁻⁵ / °C
Heat Distortion Temperature (at 18.6 kg/cm²)260°C
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance145seconds
Dielectric Strength (Kv Step-by-Step, Dry)380volts/mil
Dielectric Strength (Kv Step-by-Step, Wet)340volts/mil
Dielectric Breakdown (Step-by-Step, Dry)62Kv
Dielectric Breakdown (Step-by-Step, Wet)60Kv
Dielectric Constant (at 1 KHz, Dry)4.2
Dielectric Constant (at 1 KHz, Wet)4.3
Dissipation Factor (at 1KHz, Dry)0.007
Dissipation Factor (at 1KHz, Wet)0.011
Surface Resistance Megaohms (As is)min. 10¹⁰
Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH)10⁴
Dielectric Constant (at 1 MHz, Dry)4
Dielectric Constant (at 1 MHz, Wet)4.2
Dissipation Factor (at 1MHz, Dry)0.013
Dissipation Factor (at 1MHz, Wet)0.015
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.25%
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.72
Bulk Factor2.5
Molding Pressure500 - 8,000psi
Molding Temperature135 - 190°C
Mold Shrinkage0.001 - 0.004In / In

Regulatory & Compliance

Certifications & Compliance