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DAP K61/6230 is a general-purpose diallyl iso-phthalate molding compound that contains long-glass fiber fillers. It is supplied in flake form, making it suitable for various molding applications. This compound can be preformed and easily molded using standard compression and transfer equipment. It offers good moldability and is designed to meet the requirements of general-purpose molding applications where a balance of mechanical strength and ease of processing is essential.

Polymer Name: Diallyl Phthalate

Processing Methods: Compression Molding, Transfer Molding

End Uses: Cases, Cups, Housings, Insulators, Switches, Terminal Blocks

Density: 1720.0 - 1720.0 kg/m³

Tensile Strength: 41.34 - 68.9 MPa

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Identification & Functionality

Polymer Name
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features
  • K61 / 6230 has excellent mechanical and electrical properties with high dielectric strength and low dielectric constant.
  • It has superior heat resistance and excellent machining qualities. K61 / 6230 has a shelf life of two years at room temperature with no reduction in performance.

Applications & Uses

Plastics & Elastomers Processing Methods
Product Applications

The high strength of this material makes is ideal for switches, terminals, housings, cups, cases and insulators.

Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength13 - 17,000psi
Compressive Strength24 - 30,000psi
Tensile Strength6,000 - 10,000psi
Impact Strength (Izod Notched)3.0 - 6.0ft-lb / inch
Thermal Properties
ValueUnitsTest Method / Conditions
Dimensional Stabilitymax. 0.01%
Thermal Expansion (at -40 °C to 100 °C)2.410⁻⁵ / °C
Heat Distortion Temperature (at 18.6 kg/cm²)260°C
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance180seconds
Dielectric Strength (Kv Step-by-Step, Dry)410volts/mil
Dielectric Strength (Kv Step-by-Step, Wet)400volts/mil
Dielectric Breakdown (Step-by-Step, Dry)64Kv
Dielectric Breakdown (Step-by-Step, Wet)60Kv
Dielectric Constant (at 1 KHz, Dry)4
Dielectric Constant (at 1 KHz, Wet)4.1
Dissipation Factor (at 1KHz, Dry)0.008
Dissipation Factor (at 1KHz, Wet)0.009
Surface Resistance Megaohms (As is)min. 10¹⁰
Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH)10⁴
Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH)6000
Dielectric Constant (at 1 MHz, Dry)3.8
Dielectric Constant (at 1 MHz, Wet)3.9
Dissipation Factor (at 1MHz, Dry)0.012
Dissipation Factor (at 1MHz, Wet)0.013
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.25%
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.72
Bulk Factor6
Molding Pressure500 - 8,000psi
Molding Temperature135 - 170°C
Mold Shrinkage0.001 - 0.004In / In

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
2 years