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Cosmic Epoxy E4930R

1 of 25 products in this brand
Cosmic Epoxy E4930R is a mineral-filled epoxy molding compound supplied in granular form. It is designed for encapsulating various electronic components, including optocouplers, capacitors, resistors, resistor networks, transistors, SOICs (Small Outline Integrated Circuits), and QFPs (Quad Flat Packages). This material helps protect and insulate these components, ensuring their proper functioning in electronic applications.

Polymer Name: Epoxy Resins & Compounds

End Uses: Capacitors, Encapsulant, Optocoupler, Resistor, Transistor

Volume Resistivity: 10000000000000.0 - 10000000000000.0 Ohm-m

Flexural Strength: 103.35 - 103.35 MPa

Knowde Enhanced TDS

Identification & Functionality

Fillers Included
Plastics & Elastomers Functions
Technologies

Features & Benefits

Key Features
  • It has excellent moisture resistance and thermal cycling stability.
  • Standard spiral flow range is 30-40” (EMMI) at 160 0C and 1000 psi, and a flow duration of 40-50 seconds at 325 - 1000 psi.
  • It has a hot plate gel time of 35-45 seconds at 160 0C.

Applications & Uses

Product Applications

Used to encapsulate optocouplers, capacitors, resistors, resistor networks, transistors, SOIS’s and QFP.

Properties

Flame Rating
Physical Form
Flame Rating
UL 94 V0
Mechanical Properties
ValueUnitsTest Method / Conditions
Flexural Strength15000psi
Flexural Modulus2.0 x 10⁶psi
Compressive Strength28000psi
Tensile Strength12000psi
Impact Strength (Izod Notched)0.6ft-lb / inch
Barcol Hardness65
Thermal Properties
ValueUnitsTest Method / Conditions
Heat Deflection Temperature260°C
Glass Transition Temperature (Tg)165°C
Coefficient of Linear Expansion (Alpha 1)25 x 10⁻⁶°C
Coefficient of Linear Expansion (Alpha 2)80 x 10⁻⁶°C
Thermal Conductivity30 x 10⁻⁴cal/sec/cm²/°C/cm
Electrical Properties
ValueUnitsTest Method / Conditions
Arc Resistance180seconds
Volume Resistance1 x 10¹⁵Ohm - cm
Surface Resistance1 x 10¹⁵Ohm - cm
Dielectric Strength (Kv Step-by-Step, Wet)350volts/mil
Dielectric Breakdown (Step-by-Step, Wet)56Kv
Dielectric Constant (at 1 KHz, Wet)4.2
Dissipation Factor (at 1KHz, Wet)0.012
Dielectric Constant (at 1 MHz, Wet)4.5
Dissipation Factor (at 1MHz, Wet)0.011
Moisture Properties
ValueUnitsTest Method / Conditions
Water Absorption (at 50 °C,48 hours)0.25%
Processing Information (Molding)
ValueUnitsTest Method / Conditions
Specific Gravity1.85
Bulk Factor2 - 5
Molding Pressure500 - 8,000psi
Molding Temperature150 - 180°C
Mold Shrinkage0.002 - 0.004In / In

Regulatory & Compliance

Certifications & Compliance