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Duralco™ 128 is highly conductive, ceramic filled, electrically resistant adhesive and potting compound. Just mix, apply and cure at room temperature. 128 is ideal for use in rectifiers, high power devices, semi-conductors, etc.

Product Type: Adhesive, Conductive Adhesive, Encapsulant, Potting Compound

Application Area: Semiconductors

Cure Method: Air Dry, Heat Cure

Chemical Family: Ceramics

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Chemical Family
Major Constituent
Aluminium

Features & Benefits

Applications & Uses

Application Area
Application Procedure

Just mix the resin and hardener, apply and cure at room temp. Curing may be accelerated with mild heat.

Properties

Physical Properties
ValueUnitsTest Method / Conditions
Volume Resistance10^15ohm-cm-
Thermal Conductivity20.0BTU-in/Hr.Ft2°F-
Viscosity 79000.0cps-
No. of Components2.0--
Mix Ratio100/5R/H-
Cure Cycle (at 75°F)16 - 24hours-
Temperaturemax. 500°F-

Packaging & Availability

Availability
Cat. No. Description Temp.
Duralco 128 8 oz. 500°F