Products

Duralco™ 128 is highly conductive, ceramic filled, electrically resistant adhesive and potting compound. Just mix, apply and cure at room temperature. 128 is ideal for use in rectifiers, high power devices, semi-conductors, etc.

Resbond™ 989 is a high purity, general purpose, room temperature curing adhesive with excellent adhesion to ceramics, graphite, metals and glass. 989 offers high bond strength and solvent and electrical resistance and can be dispensed automatically for high speed production applications.

Duralco™ 132 is Aluminum metal filled epoxy that cures at room temp to form machinable, thermally conductive bond lines. Duralco 132 offers the maximum conductivity available in a 500ºF epoxy system.

Duralco™ 133 is a two component, heat curing, Aluminum filled, Conductive epoxy. Suitable for high temp. tooling and applications requiring machinable repairs. Duralco 133 combines the excellent properties of Duralco 132 with Cotronics higher temperature epoxy system to provide up to 600°F service.