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Resbond™ 989 is a high purity, general purpose, room temperature curing adhesive with excellent adhesion to ceramics, graphite, metals and glass. 989 offers high bond strength and solvent and electrical resistance and can be dispensed automatically for high speed production applications.

Product Type: 1K (1 component) Adhesive

Application Area: Sensors

Compatible Substrates & Surfaces: Ceramic, Glass, Metal

Cure Method: Air Dry, Heat Cure

Technical Data Sheet
  • TypeDocument Name
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Knowde Enhanced TDS

Identification & Functionality

Base
Al2O3

Features & Benefits

Applications & Uses

Application Area
Compatible Substrates & Surfaces
Applications
  • 989 Fast Set is ideal for production applications where fast cures and automated dispensing is critical.
  • Applications Include: bonding alumina, metals, ceramics, graphite, and glass in electrical components, appliances, instruments, etc.

Properties

Physical Properties
ValueUnitsTest Method / Conditions
Compressive Strength3000.0psi-
Flexural Strength1100.0psi-
Thermal Expansion4.510^-6/°C-
Thermal Conductivity15.0BTU-in/Hr.Ft2°F-
Dielectric Strength200.0volts/mil.-
Volume Resistivity10^8ohm-cm-
No. of Components1.0--
Cure (at R.T.)2 - 4hours-
Cure (at 200°F)1/2 - 1hours-
Continuous Use Temperature3000.0°F-

Technical Details & Test Data

Users Report
  • Bonds Silicon Carbide nozzles into alumina sleeving in a high temperature instrument chamber.
  • Bonds Nickel pins, measuring 0.03" dia. into 0.04" holes in an aluminum nitride ceramic. These parts were quenched (from 900ºC) in liquid Nitrogen without failure.
  • Bonds Kanthal to Mullite tubes, forming inexpensive custom sized and durable high temp. Heating elements.