Knowde Enhanced TDS
Identification & Functionality
- CASE Ingredients Functions
- Technologies
- Product Families
Features & Benefits
- CASE Ingredients Features
- Product Highlights
- Improves electrical conductivity in metal filled conductive paste formulations
- Soluble in most resin systems
- May improve the thermal conductivity in some formulations
Applications & Uses
- Applications
- Compatible Substrates & Surfaces
- Adhesive & Sealant Type
- RECOMMENDED FORMULATION USE
A-6165 is recommended for use as an additive in combination with metal fillers (e.g. silver or Ag coated Cu) to further decrease volume resistivity in electrically conductive adhesive compositions. The recommended addition level of the A6165 to a metal-filled adhesive formulation is less than or equal to about 1% by weight of the formulation’s total resin content. Higher levels of the A-6165 can degrade the adhesion of the composition and do not necessarily further reduce volume resistivity. Addition of less than about 0.5% of by weight A-6165 to the resin base will not yield optimum electrical performance. The best electrical results are obtained when the resin system attains a gel point at or slightly above 160C. Lower cure temperatures are usually insufficient to activate the A-6165.
Properties
- Physical Form
- Appearance
- Dark brown viscous liquid
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Flash Point | min. 175 | °C | — |
| Recommended Storage Temp | 5+°C or colder | — | — |
| Recommended Storage Temperature | 5 or Below | °C | — |