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Designer Molecules EC-234

Designer Molecules EC-234 belongs to the epoxy & epoxy derivatives chemical family acts as a rheology modifieractive diluentcuring & hardening agent.

Functions: Curing Agent, Reactive Diluent, Rheology Modifier

Chemical Family: Epoxy & Epoxy Derivatives

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Knowde Enhanced TDS

Identification & Functionality

Technologies
Chemical Structure
  • Hybrid cure 
  • Low viscosity

.Designer Molecules EC-234 Chemical Structure

Features & Benefits

CASE Ingredients Features

Applications & Uses

Compatible Substrates & Surfaces
RECOMMENDED FORMULATION USE

EC-234 is recommended for use as a curative in epoxy systems and/or free-radically cured systems. EC-234 can cure both with standard free-radical initiators and epoxy catalysts such as imidizoles, amines, and Lewis acids.

Properties

Physical Form
Appearance
Light yellow liquid
Typical Properties
ValueUnitsTest Method / Conditions
Viscosity at 25°C (typical)40cP
Density1.14g/cc
Functionality2
Molecular Weightapprox. 234daltons
Recommended Storage Temp10°C or below
Recommended Storage Temperature10 or Below°C