Designer Molecules EC-326

Designer Molecules EC-326 belongs to the bisphenol a type epoxy chemical family acts as a chain extendercuring & hardening agent, toughener.

Functions: Chain Extender, Curing Agent, Toughener

Chemical Family: Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives

Compatible Polymers & Resins: Epoxies (EP)

Features: Good Toughness, Thermal Resistance, Water Resistance

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Knowde Enhanced TDS

Identification & Functionality

CASE Ingredients Functions
Technologies
Chemical Structure
  • Hydrolytically resistant 
  • Hydrophobic 
  • Low melting point 
  • Toughener 
  • Thermal stability 
  • Does not impede free-radical cure

Designer Molecules EC-326 Chemical Structure

Features & Benefits

Applications & Uses

Compatible Polymers & Resins
Adhesive & Sealant Type
RECOMMENDED FORMULATION USE

EC-326 is recommended for use as an epoxy curative to improve toughness, hydrophobicity, and hydrolytic stability. A one-to-one equivalent ratio of EC-326 to a difunctional epoxy will (depending on the catalyst used) cure to a thermoplastic resin. To form a thermoset, a twenty equivalent percent excess, or more, of epoxy is recommended. Standard epoxy catalysts such as amines, imidizoles, and Lewis acids work well to cure the EC-326 with epoxy resins.

Properties

Physical Form
Appearance
White/yellow solid
Typical Properties
ValueUnitsTest Method / Conditions
Viscosity at 25°C (typical) - (super cooled liquid)2200cPHaake Rheometer
Melting Point (typical)40 - 45°CDSC
Density1.12g/cc
Flash Pointmin. 200°CClosed Cup
Functionality2
Molecular Weightapprox. 326daltons
Decomposition Temperature (approx.) 250 °CTGA
Recommended Storage Temp25°C or below
Recommended Storage Temperature25 or Below°C