Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Base Chemicals Functions
- CASE Ingredients Functions
- Technologies
- Product Families
- Chemical Structure
- Low modulus
- Hydrophobic
- Toughener
- Thermal stability
- Hydrolytically resistant thermosets
- Does not impede free-radical cure
Features & Benefits
- CASE Ingredients Features
Applications & Uses
- Markets
- Compatible Polymers & Resins
- Adhesive & Sealant Type
- RECOMMENDED FORMULATION USE
EC-861 is recommended for use as an epoxy curative for systems requiring a high level of toughness, hydrophobicity, and low modulus. EC-861 curative should be used in conjunction with multifunctional epoxies or in the presence of about a 20% excess of difunctional epoxies if a thermoset is desired. Formulations containing approximately one-to-one equivalent levels with difunctional epoxies can result in tough thermoplastics. Standard epoxy catalysts such as amines, imidizoles, and Lewis acids can also work to cure EC-861 with epoxy resins.
Properties
- Physical Form
- Appearance
- Yellow liquid
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Viscosity at 25°C (typical) | 3000 | cP | — |
| Functionality | 2 | — | — |
| Molecular Weight | 861 | daltons | — |
| Onset of Decomposition | min. 350 | °C | — |
| Recommended Storage Temp | Room Temperature | — | — |