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Designer Molecules PEAM-1769

PEAM-1769 is a polyester acrylate/methacrylate that exhibits excellent adhesion, low warpage, and hydrophobicity. The oligomer has very high thermal stability and low volatility. It can be used as a base oligomer in a formulation or an additive.

Chemical Family: Acrylics, Acrylates & Methacrylates, Polyesters

Compatible Substrates & Surfaces: Metal

Features: Improves Adhesion, Water Resistance

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Identification & Functionality

CASE Ingredients Functions
Technologies
Chemical Structure
  • Ultra low modulus 
  • Thermal stability 
  • Hydrophobic 
  • Adhesion to metals 
  • High adhesion to various substrates 
  • Flexibilizer

Designer Molecules PEAM-1769 Chemical Structure

Features & Benefits

CASE Ingredients Features

Applications & Uses

Compatible Substrates & Surfaces
RECOMMENDED FORMULATION USE

PEAM-1769 is recommended for use as a base resin or an additive to reduce stress. It has excellent adhesion on most substrates with low stress and low shrinkage due to its high Tg polycyclic repeat units. The oligomer has good solubility in both aliphatic and aromatic solvents and monomers.

Properties

Physical Form
Appearance
Amber liquid
Typical Properties
ValueUnitsTest Method / Conditions
Viscosity at 25°C (typical)20000cPHaake Rheometer
Functionality2
Molecular Weight1769daltons
Weight Loss at 300°Cmax.3.0%TGA
Decomposition Temperaturemin. 375°CTGA
Recommended Storage Temp10°C or below
Recommended Storage Temperature10 or Below°C
Glass Transition Temperature (cured with 2% Dicumyl Peroxide)-40 (-10)°CTMA (DMA)
Coefficient of Thermal Expansion (cured with 2% Dicumyl Peroxide)α1 110 (α2 250)ppm/°CTMA
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide -65°C1300MPaRheometrics Rheometer
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 25°C48MPaRheometrics Rheometer
Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 150°C1MPaRheometrics Rheometer