Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- CASE Ingredients Functions
- Technologies
- Product Families
- Chemical Structure
- Low modulus
- High adhesion to various substrates
- Hydrophobic
- Adhesion to metals
- Excellent hydrolytic resistance
- Flexibilizer
Features & Benefits
- CASE Ingredients Features
Applications & Uses
- Markets
- RECOMMENDED FORMULATION USE
PEM-1066 is recommended for use as a base resin or an additive to reduce stress. It has excellent adhesion on most substrates. It has superior hydrolytic resistance due to the secondary alcohol ester residues in the backbone. The oligomer has good solubility in both aliphatic and aromatic resins.
Properties
- Physical Form
- Appearance
- Light yellow liquid
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Viscosity at 25°C | 20000 | cP | Brookfield C/P |
| Functionality | 2 | — | — |
| Molecular Weight | 1066 | daltons | — |
| Weight Loss at 300°C | max. 3.0% | % | TGA |
| Decomposition Temperature | min. 300°C | °C | TGA |
| Recommended Storage Temp | 10°C or below | — | — |
| Recommended Storage Temperature | 10 or Below | °C | — |
| Glass Transition Temperature (cured with 2% Dicumyl Peroxide) | -8 (10) | °C | TMA (DMA) |
| Coefficient of Thermal Expansion (cured with 2% Dicumyl Peroxide) | α1 88 (α2 247) | ppm/°C | TMA |
| Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide -65°C | 2.64 | GPa | Rheometrics Rheometer |
| Dynamic Tensile Modulus Cured with 2% Dicumyl Peroxide 25°C | 0.41 | GPa | Rheometrics Rheometer |