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Elix™ ABS M545TF

1 of 64 products in this brand
Injection molding grade for food contact applications. High flowability.

Polymer Name: Acrylonitrile Butadiene Styrene (ABS)

Processing Methods: Injection Molding

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Properties

Physical Form
Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Modulus (23°C/50% Relative Humidity, 1 mm/min)2250MPaISO 527-1,-2
Yield Stress (23°C/50% Relative Humidity, 50 mm/min)42MPaISO 527-1,-2
Yield Strain (23°C/50% Relative Humidity, 50 mm/min)2.6% ISO 527-1, -2
Tensile Strain at Break (23°C/50% Relative Humidity, 50 mm/min)min. 25%ISO 527-1,2
Flexural Strength (23°C/50% Relative Humidity, 2 mm/min)70MPa ISO 178
Flexural Modulus (23°C/50% Relative Humidity, 2 mm/min)2300MPaISO 178
Charpy Notched Impact Strength (23°C, 50% Relative Humidity)15kJ/m2ISO 179-1eA
Charpy Notched Impact Strength (-30°C, 50% Relative Humidity)7kJ/m2ISO 179-1eA
Charpy Impact Strength (23°C, 50% Relative Humidity)110kJ/m2ISO 179-1eU
Charpy Impact Strength (-30°C, 50% Relative Humidity)90kJ/m2ISO 179-1eU
Izod Notched Impact Strength (23°C, 50% Relative Humidity)17kJ/m2ISO 180-1A
Izod Notched Impact Strength (-30°C, 50% Relative Humidity)7kJ/m2ISO 180-1A
Ball Indentation Hardness (23°C/50% Relative Humidity)110N/mm2 ISO 2039-1
Physical Properties
ValueUnitsTest Method / Conditions
Melt Volume Flow Rate - MVFR (220°C; 10 Kg)32cm3/(10 min)ISO 1133
Molding Shrinkage - Normal (60X60X2)0.4 - 0.7%ISO 294-4
Molding Shrinkage - Parallel (60X60X2)0.4 - 0.7%ISO 294-4
Density (25°C)1.05g/cm3ISO 1183-1
Thermal Properties
ValueUnitsTest Method / Conditions
Coefficient Of Linear Thermal Expansion - Parallel (23 to 55°C)0.910-4/K ISO 11359 -1,2
Deflection Temperature Under Load (0.45 Mpa)98°C ISO 75-1,2
Deflection Temperature Under Load (1.80 Mpa)94°C ISO 75-1,2
Vicat Softening Temperature (50 N, 50°C/h)98°CISO 306
Electrical Properties
ValueUnitsTest Method / Conditions
Relative Permittivity (23°C/50 % Relative Humidity, 1 MHz)2.9-IEC 60250
Relative Permittivity (23°C/50 % Relative Humidity, 100 Hz)3-IEC 60250
Dissipation Factor (23°C/50 % Relative Humidity, 1 MHz)90 10-4IEC 60250
Dissipation Factor (23°C/50 % Relative Humidity, 100 Hz)50 10-4IEC 60250
Volume Resistivity (23°C/50 % Relative Humidity)10000000000000Ohm·mIEC 60093
Surface Resistivity (23°C/50 % Relative Humidity)1000000000000000Ohm IEC 60093
Comparative Tracking Index - CTI (23°C/50 % Relative Humidity, Solution A)600RatingIEC 60112
Electric Strength (23°C/50 % Relative Humidity, 1 mm)35kV/mmIEC 60243-1
Flammability
ValueUnitsTest Method / Conditions
Burning Rate (US-FMVSS, 2.0 mm)60mm/minISO 3795
Glow Wire Test - GWFI (2.0 mm)700°C IEC 60695-2-12
Processing Information (Injection Molding)
ValueUnitsTest Method / Conditions
Mold Temperature70°CISO 294
Injection Velocity240mm/sISO 294

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