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Arnite® T04 200

1 of 75 products in this brand
Arnite® T04 200 is a high-performance engineering plastic renowned for its impressive combination of high strength, rigidity, and excellent processing characteristics. These qualities make it highly suitable for a wide spectrum of applications in the automotive, electrical and electronic, and consumer goods industries.

Polymer Name: Polybutylene Terephthalate (PBT)

Processing Methods: Injection Molding

Technical Data Sheet
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Identification & Functionality

Plastics & Elastomers Functions
Technologies

Features & Benefits

Applications & Uses

Plastics & Elastomers Processing Methods

Properties

Thermal Properties
ValueUnitsTest Method / Conditions
Melting Temperature (10°C/min)225°CISO 11357-1/-3
Other Properties
ValueUnitsTest Method / Conditions
Water Absorption0.45%Sim. to ISO 62
Humidity Absorption0.18%Sim. to ISO 62
Density1300kg/m³ISO 1183
Rheological Properties
ValueUnitsTest Method / Conditions
Melt Volume-Flow Rate (at 250 / * °C, 2.16 / * kg)75cm³/10minISO 1133

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Machinery for Injection Molding

Arnitel® grades can be processed on general injection molding machines.
Screw Geometry

  • Typically 3-zone screw designs with volumetric compression ratios of approximately 2.5 work fine.

Steel Type

  • Abrasive resistant tool steels which are normally used for glass and/or mineral reinforced materials are also to be used for Arnitel® polymers in tools, nozzles and screws.

Nozzle Temperature Control

  • The use of an open nozzle with good temperature control and an independently-controlled thermocouple nearby the tip and heater bands with sufficient output is recommended.

Hot Runner Layout

  • Try to achieve a close contact with your hot runner supplier and Envalior as the material supplier, to be sure that the right hot runner system is chosen.
  • When processing Arnite® with hot runners, keep in mind these basic rules:
  1. Central bushing heated separately
  2. Only use external heated system
  3. Manifold heated from both sides
  4. Tip with thermocouple in front (near gate)
  5. Very accurate temperature control in the gate area
Secant Modulus-Strain

DSM Engineering Materials Arnite T04 200 Secant Modulus-Strain

Chemical Resistance
Chemical TypeChemical NameResistance
OtherAcetic acid (10% by mass) at 23°Cnot resistant
OtherAcetic acid (95% by mass) at 23°Cnot resistant
KetonesAcetone at 23°Climited resistant, tests necessary to verify
OtherAcetophenone at 23°Cresistant
OtherAcetylene at 23°Cresistant
OtherAliphatic amines at 23°Cresistant
OtherAliphatic hydrocarbons at 23°Cresistant
OtherAllyl alcohol at 23°Cresistant
OtherAluminum acetate (saturated) at 23°Cresistant
OtherAluminum hydroxide (saturated) at 23°Cresistant
OtherAluminum salts of mineral acids (saturated) at 23°Cresistant
OtherAmino acids (saturated) at 23°Cresistant
OtherAmmonia at 23°Climited resistant, tests necessary to verify
OtherAmmonium salts of mineral acids (10% by mass) at 23°Cresistant
OtherAmyl acetate at 100°Cnot resistant
OtherAmyl acetate at 23°Cresistant
OtherAmyl alcohol at 23°Cresistant
OtherAniline at 23°Climited resistant, tests necessary to verify
OtherAnodizing liquid (HNO3/H2SO4) at 23°Climited resistant, tests necessary to verify
OtherAqua Regia (HCl/HNO3) at 23°Cnot resistant
OtherAromatic hydrocarbons at 23°Climited resistant, tests necessary to verify
OtherBariumsalts of mineral acids at 23°Cresistant
OtherBenzene at 23°Cresistant
OtherBenzene at 80°Cnot resistant
OtherBenzoic acid (20% by mass) at 23°Cnot resistant
OtherBenzoic acid (saturated) at 23°Cresistant
OtherBeverages at 23°Cresistant
OtherBleaching agent (NaOCl) at 23°Cresistant
OtherBoric acid (10% by mass) at 23°Cresistant
OtherBoron trifluoride at 23°Cnot resistant
OtherBrake fluids (DOT 3/4) at 23°Cresistant
OtherBromine water (saturated) at 23°Cnot resistant
OtherBromochlorodifluoromethane at 23°Cresistant
OtherBromotrifluoromethane at 23°Cresistant
OtherButadiene at 23°Cresistant
OtherButane at 23°Cresistant
OtherButanediols at 23°Cresistant
OtherButanediols at >140°Cnot resistant
OtherButanols at 23°Cresistant
OtherButene glycol at 23°Cresistant
OtherButene glycol at >160°Cnot resistant
OtherButene-1 at 23°Cresistant
OtherButter at 23°Cresistant
OtherButyl acetate at 23°Climited resistant, tests necessary to verify
OtherButyl acrylate at 23°Climited resistant, tests necessary to verify
OtherButyl glycolate at 23°Cresistant
OtherButyl phthalate at 23°Cresistant
OtherButyric acid (20% by mass) at 23°Cresistant
OtherCalcium chloride (saturated) at 23°Cresistant
OtherCalcium hydroxide (saturated) at 23°Cresistant
OtherCalcium hypochloride (saturated) at 23°Climited resistant, tests necessary to verify
OtherCamphor (alcoholic) (50% by mass) at 23°Cresistant
OtherCaprolactam (50% by mass) at 23°Cresistant
OtherCasein at 23°Cresistant
OtherChloramines (10% by mass) at 23°Cnot resistant
OtherChlorine water at 23°Cnot resistant
OtherChloroacetic acid (10% by mass) at 23°Cnot resistant
OtherChlorobenzene at 23°Cresistant
OtherChlorobenzene at 50°Cnot resistant
OtherChlorobromomethane at 23°Cresistant
OtherChlorodifluoroethane at 23°Cresistant
OtherChlorodifluoromethane at 23°Cresistant
OtherChlorofluoroethylene at 23°Cresistant
OtherChloroform at 23°Cnot resistant
OtherChlorosulfonic acid (10% by mass) at 23°Cnot resistant
OtherChromic acid (10% by mass) at 23°Climited resistant, tests necessary to verify
Othercis-2-butene at 23°Cresistant
OtherCitric acid (10% by mass) at 23°Cresistant
OtherCopper(II) salt (10% by mass) at 23°Cresistant
OtherCresols at 23°Cnot resistant
OtherCycloalcohols (incl their esters) at 23°Cresistant
OtherCycloalkanes at 23°Cresistant
OtherCycloalkanones at 23°Cresistant
OtherDecalin at 23°Climited resistant, tests necessary to verify
OtherDeveloper (photografic) at 23°Cresistant
OtherDibutyl phthalate at 23°Cresistant
OtherDibutyl phthalate at 60°Climited resistant, tests necessary to verify
OtherDichloroethane at 23°Cnot resistant
OtherDichloroethylene at 23°Cnot resistant
OtherDichlorofluoromethane at 23°Cresistant
OtherDichlorotetrafluoroethane at 23°Cresistant
EthersDiethyl ether at 23°Cresistant
OtherDiethylene glycol at >140°Cnot resistant
OtherDifluoromethane at 23°Cresistant
OtherDimethyl ether at 23°Cresistant
OtherDimethylformamide at 23°Cresistant
OtherDimethylsulfoxide at 23°Cresistant
OtherDioctyl phtalate at 23°Cresistant
OtherDioxan at 23°Cresistant
OtherDioxan at 60°Cnot resistant
OtherDiphenyl ether at 80°Cnot resistant
OtherDipropyl ether at 23°Cresistant
OtherEdible fats waxes and oils at 100°Cresistant
OtherElectroplating bath (acidic) at 23°Cresistant
OtherElectroplating bath (alkali) at 23°Climited resistant, tests necessary to verify
OtherEthane at 23°Cresistant
AlcoholsEthanol at 23°Cresistant
OtherEthyl Acetate at 23°Climited resistant, tests necessary to verify
OtherEthylene at 23°Cresistant
OtherEthylene carbonate at 100°Cnot resistant
OtherEthylene carbonate at 50°Cnot resistant
OtherEthylene oxide at 23°Cresistant
OtherFatty acids at 23°Cresistant
OtherFatty alcohols at 23°Cresistant
OtherFixer (photografic) at 23°Cresistant
OtherFluorinated hydrocarbons at 70°Cresistant
OtherFluorine at 23°Cnot resistant
OtherFormaldehyde (30% by mass) at 23°Cresistant
OtherFormic acid (10% by mass) at 23°Cresistant
OtherFormic acid (10% by mass) at 50°Climited resistant, tests necessary to verify
OtherFruit juices at 23°Cresistant
OtherFuel; Diesel at 85°Cresistant
OtherHardening oils at 23°Cresistant
OtherHeating oils at 23°Cresistant
OtherHeptane at 23°Cresistant
OtherHexafluoroisopropanol at 23°Cnot resistant
OtherHexamethylenetetramine at 23°Cresistant
OtherHexane at 23°Cresistant
OtherHydraulic fluids at 100°Cresistant
OtherHydrobromic acid (10% by mass) at 23°Climited resistant, tests necessary to verify
OtherHydrochloric acid (20% by mass) at 23°Climited resistant, tests necessary to verify
OtherHydrofluoric acid (40% by mass) at 23°Cnot resistant
OtherHydrogen at 23°Cresistant
OtherHydrogen peroxide (0.5% by mass) at 23°Cresistant
OtherHydrogen peroxide (3% by mass) at 23°Cresistant
OtherHydrogen peroxide (30% by mass) at 23°Cresistant
OtherHydrogen sulfide (10% by mass) at 23°Cresistant
OtherHydroiodic acid at 23°Climited resistant, tests necessary to verify
OtherHydroquinone (5% by mass) at 23°Cresistant
OtherImpregnating oils at 23°Cresistant
OtherInk at 23°Cresistant
OtherIron(III)chloride (neutral) (10% by mass) at 23°Cresistant
OtherIsocyanates (aromatic) at 23°Cresistant
OtherIsooctane at 80°Cresistant
OtherIsopropanol at 23°Cresistant
OtherIsopropanol at 60°Climited resistant, tests necessary to verify
OtherKetones (aliphatic) at 23°Climited resistant, tests necessary to verify
OtherLactic acid at 10°Cresistant
OtherLead acetate (10% by mass) at 23°Cresistant
OtherLinseed oil at 23°Cresistant
OtherLithium bromide (10% by mass) at 23°Cresistant
OtherLithium hydroxide (10% by mass) at 23°Cresistant
OtherLithium hydroxide (10% by mass) at 80°Cnot resistant
OtherLubricating oil (gear) at <130°Cresistant
OtherLubricating oil (hydraulics) at <130°Cresistant
OtherLubricating oil (transformers) at <130°Cresistant
OtherMagnesium salts (10% by mass) at 23°Cresistant
OtherMaleic acid (saturated) at 23°Cresistant
OtherManganese salts (10% by mass) at 23°Cresistant
OtherMercury at 23°Cresistant
OtherMethane at 23°Cresistant
AlcoholsMethanol at 23°Cresistant
OtherMethyl acetate at 23°Climited resistant, tests necessary to verify
OtherMethyl ethyl ketone at 23°Cresistant
OtherMethyl formate at 23°Cresistant
OtherMethylene chloride at 23°Cnot resistant
OtherMilk at 23°Cresistant
Othern-Butyl ether at 23°Cresistant
Othern-Butyl glycol at 23°Cresistant
OtherNaphtha at 23°Cresistant
OtherNaphthalene at 23°Cresistant
OtherNaphthenic acids at 23°Cresistant
OtherNickel salts (10% by mass) at 23°Cresistant
OtherNitric acid (2% by mass) at 23°Cresistant
OtherNitric acid (conc.% by mass) at 23°Climited resistant, tests necessary to verify
OtherNitrobenzene at 23°Cresistant
OtherNitrocellulose lacquers (alcoholic) at 23°Climited resistant, tests necessary to verify
OtherNitrocellulose lacquers (non-alcoholic) at 23°Climited resistant, tests necessary to verify
OtherNitrogen oxides at 23°Cresistant
OtherNitrotoluene at 23°Cresistant
OtherNitrous fumes at 23°Climited resistant, tests necessary to verify
OtherNitrous oxide at 23°Cresistant
OtherOctane at 23°Cresistant
OtherOctene at 23°Cresistant
OtherOil (transformers, switchgear) at 50°Cresistant
OtherOils (vegatable, mineral, ethereal) at 23°Cresistant
OtherOleic acid at 23°Cresistant
OtherOleum (H2SO4+SO3) at 23°Cnot resistant
OtherOxalic acid (10% by mass) at 23°Cresistant
OtherOzone at 23°Cnot resistant
OtherPaint solvents at 23°Climited resistant, tests necessary to verify
OtherPalmatic acid at 80°Cresistant
OtherParaffin at 23°Cresistant
OtherPetroleum at 23°Cresistant
OtherPetroleum ether and solvents at 80°Cresistant
OtherPhenol (alc. sol.) (70% by mass) at 23°Cnot resistant
OtherPhenol (conc.% by mass) at 23°Cnot resistant
OtherPhenol at >40°Cnot resistant
OtherPhosphate sol. (neutral, alkaline) (10% by mass) at 23°Cresistant
OtherPhosphine at 23°Cresistant
OtherPhosphoric acid (10% by mass) at 23°Cnot resistant
OtherPhosphoric acid (3% by mass) at 23°Cresistant
OtherPhosphoric acid (conc.% by mass) at 23°Cnot resistant
OtherPhthalic acid (saturated) at 23°Cresistant
OtherPolyols at 23°Cresistant
OtherPotassium bromide (10% by mass) at 23°Cresistant
OtherPotassium chloride (10% by mass) at 23°Cresistant
OtherPotassium chloride (10% by mass) at 70°Cnot resistant
OtherPotassium dichromate (5% by mass) at 23°Climited resistant, tests necessary to verify
OtherPotassium hydroxide (50% by mass) at 23°Cnot resistant
OtherPotassium nitrate (10% by mass) at 23°Cresistant
OtherPotassium permanganate (1% by mass) at 23°Cresistant
OtherPropane at 23°Cresistant
OtherPropanol at 23°Cresistant
OtherPropanol at >100°Cnot resistant
OtherPropene at 23°Cresistant
OtherPropionic acid (5% by mass) at 23°Cresistant
OtherPyruvic acid (10% by mass) at 23°Cresistant
OtherResorcinol (alcoholic) (50% by mass) at 23°Cnot resistant
OtherSalicylic acid (saturated) at 23°Cresistant
OtherSilane at 23°Cresistant
OtherSilicone oils at <80°Cresistant
OtherSoap solution (10% by mass) at 80°Cresistant
OtherSodium carbonate (10% by mass) at 23°Cresistant
OtherSodium chlorate (10% by mass) at 23°Cresistant
OtherSodium dodecylbenzenesulfonate at 23°Cresistant
OtherSodium hydrogen carbonate (10% by mass) at 23°Cresistant
OtherSodium hydrogen sulfate (10% by mass) at 23°Cresistant
OtherSodium hydrogen sulfite (10% by mass) at 23°Cresistant
OtherSodium hydroxide (10% by mass) at 23°Cresistant
OtherSodium hydroxide (10% by mass) at 80°Cnot resistant
OtherSodium hydroxide (50% by mass) at 23°Cnot resistant
OtherSodium hypochlorite (10% by mass) at 23°Cnot resistant
OtherSodium hypophosphite (10% by mass) at 23°Cresistant
OtherSodium lignosulfonate at 23°Cresistant
OtherSodium nitrilotriacetate (10% by mass) at 23°Cresistant
OtherSodium oleate at 23°Cresistant
OtherSodium salts (nitrate, sulfate) (10% by mass) at 23°Cresistant
OtherSoldering fluid at 23°Cresistant
OtherSteam at 23°Cnot resistant
OtherStearate at 23°Cresistant
OtherStearic acid at 23°Cresistant
OtherStyrene at 80°Cresistant
OtherSulfonates (10% by mass) at 23°Cresistant
OtherSulfur at 23°Cresistant
OtherSulfur dioxide (dry) at 23°Cresistant
OtherSulfur dioxide (moist) at 23°Cresistant
OtherSulfur hexafluoride at 23°Cresistant
OtherSulfuric acid (2% by mass) at 23°Cresistant
OtherSulfuric acid (conc.% by mass) at 23°Cnot resistant
OtherSulfurous acid (saturated) at 23°Cresistant
OtherTartaric acid (10% by mass) at 23°Cresistant
OtherTartaric acid (50% by mass) at 23°Cresistant
OtherTetrachloroethylene at 23°Climited resistant, tests necessary to verify
OtherTetrachloroethylene at 80°Cnot resistant
OtherTetrachloromethane at 23°Cresistant
OtherTetrahydrofuran at 23°Cresistant
OtherTetralin at 23°Cresistant
OtherTetramethylenesulfone at 23°Cresistant
OtherToluene at 100°Cnot resistant
HydrocarbonsToluene at 23°Cresistant
OtherTrichloroacetic acid (50% by mass) at 23°Cnot resistant
OtherTrichloroacetic acid ethyl ester at 23°Cnot resistant
OtherTrichloroethane at 45°Cresistant
OtherTrichloroethanol at 23°Cnot resistant
OtherTrichloroethylene at 23°Cnot resistant
OtherTrichloroethylene at >40°Cnot resistant
OtherTrichlorotrifluoroethane at 23°Cresistant
OtherTrietanolamine at 23°Cresistant
OtherTrifluoroethanol at 23°Cnot resistant
OtherTurpentine oil at 23°Cresistant
OtherTurpentine substitute at 23°Cresistant
OtherUranium fluoride at 23°Cnot resistant
OtherUric acid (20% by mass) at 23°Cresistant
OtherUrine at 23°Cresistant
OtherVaseline (acid free) at 23°Cresistant
OtherVinyl bromide at 23°Cresistant
OtherVinyl chloride at 23°Cresistant
OtherVinyl fluoride at 23°Cresistant
OtherWater (chlorinated) at 80°Climited resistant, tests necessary to verify
OtherWater at 23°Cresistant
OtherWax at 80°Cresistant
OtherXylene at 100°Cnot resistant
OtherXylene at 23°Climited resistant, tests necessary to verify
OtherYeast at 23°Cresistant
OtherZinc bromide (30% by mass) at 23°Cresistant
OtherZinc chloride (10% by mass) at 23°Cresistant
OtherZinc chloride (37% by mass) at 23°Cresistant
OtherZinc chloride at 23°Cresistant
OtherZinc iodide (30% by mass) at 23°Cresistant
OtherZinc nitrate (30% by mass) at 23°Cresistant
OtherZinc thiocyanate (30% by mass) at 23°Cresistant
OtherZinc(II)salts of mineral acids (10% by mass) at 23°Cresistant
Temperature Settings For Injection Molding

Mold temperature

  • Arnite®T can be used with a wide range of tool temperatures (60 - 100°C / 140 - 212°F). However, we recommend a low mold temperature for parts with thick walls and a high mold temperature for good dimensional stability, flow properties and surface esthetics.

Barrel temperature

  • Optimal settings are governed by barrel size and residence time. Furthermore, the level of glass and/or mineral reinforcement and the presence or absence of flame retardant have to be taken into account.

Arnite® T04 200 - Temperature Settings For Injection Molding

Mold/Tool Measured melt Nozzle Front Center Rear
60 - 100°C
140 - 212°F
240-270°C
464-518°F
240-260°C
464.-500°F
240-260°C
464.-500°F
230-250°C
446-482°F
230-240°C
446-464°F

Melt temperature

  • To generate a good and homogeneous melt, the melt temperature should always be above 240°C / 464°F. Optimal mechanical properties will be achieved at melt temperatures between 240-270°C / 464-518°F.
  • We advise to frequently measure the melt temperature by pouring the melt in a Teflon cup and inserting a thermo probe into the melt.

Hot runner temperature

  • A hot runner temperature set to the same level as the nozzle temperature should work fine and not lead to excessive overheat of the Arnite® grade. When starting up, an increased tip temperature may be necessary to overcome a frozen nozzle.
     
Stress-Strain

DSM Engineering Materials Arnite T04 200 Stress-Strain

General Processing Settings For Injection Molding

Screw rotation speed

  • To realize a good and homogeneous melt, it is advised to set a screw rotation speed resulting in a plasticizing time that is just within the cooling time.
  • The rotational speed of the screw should not exceed 6500 / D RPM (where D is the screw diameter in mm).

Back pressure

  • Back pressure should be between 30-100 bars effective. Keep it low in order to prevent nozzle-drooling, excessive shear heating and long plasticizing times.

Decompression:

  • In order to prevent nozzle drool after plasticizing and retracting the nozzle from the mold, a short decompression stroke can be used. However, to prevent oxidation of the melt, which may result in surface defects on the parts, it is recommended to keep this as short as possible.

Injection speed

  • Moderate to high injection speeds are required in order to prevent premature crystallization in the mold during injection phase and to obtain a better surface finish. Adequate mold venting is required to avoid burning at the end of the flow path (due to diesel effect).

Injection pressure

  • The real injection pressure is the result of the flowability of the material (crystallization rate, flow length, wall thickness, filling speed). The set injection pressure should be high enough to maintain the set injection speed (use set injection pressure higher than the peak pressure if possible). Tooling air vents must be effective to allow optimum filling pressure and prevent burn marks.

Holding time

  • Effective holding time is determined by part thickness and gate size. Holding time should be maintained until a constant product weight is achieved.

Holding pressure

  • The most adequate holding pressure is the level whereby no sinkmarks or flash are visible. A too high holding pressure can lead to stresses in the part.

Cooling Time

  • Actual cooling time will depend on part geometry and dimensional quality requirements as well as the tool design (gate size).
Viscosity-Shear Rate

DSM Engineering Materials Arnite T04 200 Viscosity-Shear Rate

Melt Residence Time For Injection Molding

The optimal Melt Residence Time (MRT) for Arnite® To4 200 is ≤ 6 minutes with preferably at least 50% of the maximal shot volume used. The MRT should not exceed 10 minutes.

A formula to estimate the MRT is described below:
MRT = (∏D³ρ/m) * (t/60)
Whereas:
MRT = Melt Residence Time [minutes]
D = Screw Diameter [cm]
p = Melt Density [g/cm3)
m = Shot Weight [g]
t = Cycle Time [s]

Please note: In the calculation above, the hotrunner volume has not been taken into account. When a hotrunner is part of the setup, please add the hotrunner volume to the calculation.

Startup/Shut Down/Cleaning For Injection Molding
  • Production has to be started and stopped with a clean machine. Cleaning can be done with Arnite® To, 200, applicable cleaning agents or HDPE. Hot runners can also be cleaned and put out of production cleaning them with Arnite® To4 200.
Production Breaks For Injection Molding
  • During production breaks longer than a few minutes, we advise emptying the barrel. The temperature of the barrel and the hot runner [if applicable) should be reduced to a level far enough below the melting point of the compound in order to stop decomposition of the compound.
  • When the hot runner, nozzle, or even the screw is blocked, be aware that under these conditions a sudden outburst of molten material can take place. Always wear personal safety protections for hand/eye/body.

Packaging & Availability

Storage & Handling

Material Handling For Injection Molding

Storage

  • In order to prevent moisture pick up and contamination, supplied packaging should be kept closed and undamaged. For the same reason, partial bags should be sealed before re-storage.
  • Allow the material that has been stored elsewhere to adapt to the temperature in the processing room while keeping the bag closed.

Packaging

  • Arnite®T grades are supplied in airtight packaging.

Moisture content as delivered

  • Arnite®T is delivered with a low moisture content, additional drying is required to prevent hydrolysis.

Conditioning before molding

  • To prevent moisture condensing on granules, bring cold granules up to ambient temperature in the molding shop while keeping the packaging closed.

Moisture content before molding

  • To prevent hydrolysis, the moisture content of Arnite®T should be maintained at an absolute minimum during processing.
  • A level below 0.020 wt% or even to require ultimate mechanical performance, it is recommended to dry to levels in the range 0.010 to 0.015 wt%.
  • Furthermore, pre-drying is required in case the material is exposed to moisture before molding (prolonged storage or open/damaged packaging).
  • Moisture content can be checked by water evaporation methods or manometric methods (ISO 15512).

Drying

  • Preferred driers are de-humidified driers with dew points maintained between -20 and -30°C / -4 and -22°F. Vacuum driers with N₂ purge can also be used.
Moisture content Time Temperature
[%] [h] [°c] [°F]
as delivered 3-6 100-120 212-248
open bag 3-12 100-120 212-248
  • Warm, dried granules should be prevented from cooling down and coming into contact with ambient air before entering the cylinder. Pellets should be fed with hot dried air straight from the hopper drier into the cylinder or via a closed loop system using hot dried air, from the stand-alone drier into the cylinder.
  • If the pellets have the tendency to stick to each other, we advise to use a lower drying temperature (80°C / 176F).

Regrind

  • Regrind can be used taking into account that this regrind must be clean/low dust content/not thermally degraded/dry, of same composition and similar particle size as the original material. The acceptable level of regrind depends on the application requirements (e.g. UL Yellow Card). Be aware that regrind can cause some small color deviations.