- Chemical Family:Epoxy & Epoxy Derivatives
- Product Type:Potting Compound, 2K (2 component) Adhesive
- Cure Method:Heat Cure, Air Dry
- Application Area:Semiconductors, Printed Electronics, Electrical Components, Photonic Devices, Cryogenic Applications, Interconnect
- Compatible Substrates & Surfaces:Glass, Plastics, Metal, Ceramic
EPOXIBOND™ EB-107LP-1 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.