Products

SetWORX™ U-47MP is a two component, urethane adhesive & encapsulating material which cures to a resilient polyurethane polymer. It finds use as an adhesive, potting and encapsulating material. U-47MP provides a sag resistent bead when dispensed and delivers excellent adhesion to many materials including metals, glass and engineering plastics.

EC-1190 is an epoxy encapsulating system with a very low density for use in the aerospace and medical industries. EC-1190 is low viscosity and can cure at room temperature when used with catalyst EH-21. EC-1190 has excellent chemical resistance and a low coefficient of thermal expansion (CTE).

EPOXIBOND™ EB-135LP is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume & cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics.

EC-1106 is an electronic grade Optically Clear Epoxy, Encapsulating and Potting Compound. This heat curing system has very low viscosity and long work life.