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EPOXICAST™ EC-1190

1 of 8 products in this brand
EC-1190 is an epoxy encapsulating system with a very low density for use in the aerospace and medical industries. EC-1190 is low viscosity and can cure at room temperature when used with catalyst EH-21. EC-1190 has excellent chemical resistance and a low coefficient of thermal expansion (CTE).

Product Type: Encapsulant, Potting Compound

Application Area: Aerospace Applications, Medical Devices

Cure Method: Air Dry

Chemical Family: Epoxy & Epoxy Derivatives

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Cure Method
Instruction for Use

The individual components containing fillers should be stirred or agitated without introducing excessive air before use to ensure that all fillers are properly dispersed. To obtain the best cured properties; accurate proportioning and thorough mixing are essential.

Mix contents thoroughly each time before removing material. To each 100 grams of Epoxicast EC-1190, add appropriate amount of Hardener of your choice and mix it well preferably using a mechanical mixer. Vacuum degasses for about five minutes to remove any dissolved or entrapped air. Proceed with the bonding application and cure as recommended.

Industrial Usage

These materials are intended for industrial use only, and the practices of good housekeeping, safety and cleanliness should be followed before, during and after use.

Properties

Color
Performance Properties
ValueUnitsTest Method / Conditions
Mix Ratio by Weight19
Mixed Viscocity (at 25°C)2000 - 3000cPs
Pot Life (at 25°C, 500g)1 - 2 hours
Recommended Cure (at 65°C)3hours
Alternate Cure (at 25°C)24 - 48hours
Specific Gravity0.74
Hardness86Shore D
Flexural Strength6500psi
Compressive Strength8000psi
Linear Shrinkage0.02%
Water Absorption (24 hr immersion at Room Temperature)0.4%
Glass Transition Temperature (Tg)60°C
Coefficient of Thermal Expansion (<Tg)4510^-6/°C
Dielectric Strength380Volts/mil
Dielectric Constant (at 1 kHz)2.7
Dielectric Constant (at 1 MHz)2.3
Dissipation Factor (at 1 kHz)0.03
Volume Resistivitymin. 1.0x10^13Ω-cm
Performance Properties
Hardener EH-75
Mix ratio by weight, phr 16
Mixed Viscosity at 25°C, cp 4,000-6,000
Pot life at 25°C (500 gram) 3-4 hrs
Recommended Cure 3 hrs/80°C
Alternate Cure 6-8 hr/65°C
Color Charcoal
Specific Gravity 0.76
Hardness, Shore D 91
Flexural Strength, psi 6700
Compressive Strength, psi 8000
Linear Shrinkage (%) 0.06
%Water Absorption (24 hr immersion at RT) 0.3
Glass Transition Temperature (Tg), °C 85
Coefficient of Thermal Expansion, ppm/°C (<Tg) 45
Dielectric Strength, Volts/mil 375
Dielectric Constant at 1 kHz 2.9
Dielectric Constant at 1 MHz 2.7
Dissipation Factor at 1 kHz 0.05
Volume Resistivity, ohm-cm 1.0x10^13

Properties of EH-75 when combine with EC-1190.

Safety & Health

Warning

Although the system contains low volatility materials, care should be taken in handling. Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.

Storage & Handling

Shelf Life

The shelf life of these materials is greater than one year when stored in unopened containers at an average temperature of 25°C.