Products

FCT RMA250 is rosin mildly activated tin-lead solder paste with pin-testable flux residue. RMA250 has increased activity over standard no-clean solder pastes, which improves wetting on difficult to solder surfaces. RMA250 shows excellent wetting, very low solder balling and graping, and has low voiding potential.

FCT WS890 is an excellent all-around water-soluble lead-free solder paste. WS890 has superior wetting, very low solder balling and graping. WS890 has been formulated for environmental stability giving long stencil life and excellent print characteristics. When coupled with SN100CV or LF-C2 alloys, WS890 provides a high reliability solution for harsh environments.

FCT WS889 is a high activity water-soluble lead-free solder paste. WS889 has excellent wetting, very low solder balling and graping, and low voiding potential. WS889 flux residues are easy to clean using warm D.I. water.

FCT NC722 is a low melting no-clean lead-free solder paste with pin-testable flux residue formulated for use with tin-bismuth alloys. NC722 is an excellent choice for applications which require reflow temperatures below that of standard lead-free alloys. NC722 is also halide and halogen free (zero halogens).

FCT NL930PT is no-clean lead-free solder paste with pin-testable flux residue. NL930PT has excellent shelf and stencil life, and responds well to pauses in printing. It prints well through fine pitch and small area ratio apertures. NL930PT shows excellent wetting, very low solder balling and graping, and has low voiding potential. It is also halide and halogen free and contains no intentionally added halogens (zero halogen). High reliability solder joints can be achieved when NL930PT is coupled with SN100CV or LF-C2 solder alloys.

FCT WS888 is an environmentally stable water-soluble lead-free solder paste. WS888 has excellent shelf and stencil life, and responds well to pauses in printing. WS888 is also halide free.

FCT NL932HF is a best in class no-clean lead-free solder paste. NL932HF has excellent shelf and stencil life, and responds well to pauses in printing. It prints well through fine pitch and small area ratio apertures. NL932HF shows excellent wetting, very low solder balling and graping, and has low voiding potential. It is also halide and halogen free and contains no intentionally added halogens (zero halogen). When coupled with SN100CV or LF-C2 alloys, NL932HF provides a high reliability solution for harsh environments.