Chemraz™ 657

Specifically developed to meet the demands of aggressive dry plasma systems, Chemraz® 657 perfluoroelastomer's unique formulation provides enhanced plasma resistance and minimal contamination resulting in less downtime and higher wafer processing yields. Recommended primarily for both static and dynamic oxide etch wafer processing applications, Chemraz 657 remains stable at service temperatures up to 280°C (536°F) with excursions to 300°C (572°F).