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BAI YUN® SKF323 Industrial Silicone Sealant Glue For Electronic Components

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BAI YUN® SKF323 Industrial Silicone Sealant Glue For Electronic Components Industrial Silicone Sealants 300 ml / pc adhesion for electronic components.

Product Type: 1K (1 component) Sealant

Compatible Substrates & Surfaces: Aluminum, Glass, Metal, Plastics

Chemical Family: Silicones

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    Identification & Functionality

    Chemical Family
    Origin

    China.

    Features & Benefits

    Features
    • One component, neutral alkoxy-cure silicone sealant.
    • Excellent adhesion to a variety of substrates, including anodized aluminum, glass, ABS, PBT, PET, PVC, PC, etc.
    • Excellent resistance to durability test: Passed thermal shock test(-40-85℃), damp-heat test(85℃/85%RH/1000 h), and so on related aging test.
    • Excellent high and low temperature resistance, keeping stable performance within the range -50 ℃ ~ +180 ℃

    Applications & Uses

    Compatible Substrates & Surfaces
    Applications
    • Bonding and sealing of lamp products such as T8 tube, energy-saving lamp and automobile lamp;
    • Structural bonding and sealing of various glass, aluminum and engineering plastics;
    • Other industries need to bond or seal a variety of USES.
    Instructions
    • The surface of substrate must be clean and dry, preferred solvents including isopropanol, acetone, and methyl ethyl ketone.For some special substrates, such as PP and PTEE, needed chemical corrosion or plasma treatment to meet bonding effect.
    • Match pneumatic dispenser or machine to meet dispensing process.
    • After skin formation, cure continues inward from the surface. In 24 hours (at 25℃and 50% relative humidity). SMG533-S will cure to a depth of about 3.3 mm. The deep-seated part, especially the part that has limit contact with air has longer curing time. Similarly curing time would extend in low-temperature condition.

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Appearance (Before Curing)White or gray pasteEye-measurement
    Density (Before Curing)1.6 ± 0.02g/cm3GB/T 13354-1992
    Surface Dry Time (Before Curing)3~5minGB/T13477.5-20
    Extrusion Rate (Before Curing)min. 50,0.2, 25, 4g/min,MPa,℃,mm0.2MPa, 25℃, 4mm
    Hardness (After Total Curing)60 ± 2Shore AGB/T 531-1999
    Tensile Strength (After Total Curing)min. 1.1MPaGB/T 528-1998
    Elongation At Break (Cured-After 21 Days At 23°C (73°F) And 50% Rh)min. 110%GB/T 528-1998
    Volume Resistivity (After Total Curing)min. 1.0×10^13Ω.cmGB/T 1962-92
    Dielectric Strength (After Total Curing)min. 0KV/mmGB/T 1408.1-1999
    Working Temperature (After Total Curing)-50 to 220°C

    Regulatory & Compliance

    Certifications & Compliance

    Safety & Health

    Attention
    • Far away from children by storage.
    • In case of contact with shin, wash with water.
    • If accident contact with eyes, flush with plenty of water immediately.
    • Proposed use in a well-ventilated place.

    Packaging & Availability

    Packing

    Plastic drum packing 300 ml or 2600ml .
    Minimum Order Quantity: Cartridge / Sausage Packaging 1000PCS;Drum Packaging 3Kits.

    Delivery Time: 7-14 days.

    Supply Ability: Cartridge / Sausage Packaging 1000000PCS/month; Drum Packaging 10000 Kits / month.

    Storage & Handling

    Shelf Life

    Shelf life is 6 month under dry and cool place under 27℃.