Products

HeBoFill® LL-SP 120 is a Boron Nitride powder of high purity. Its high crystallinity results in excellent lubrication. The powder is also characterised by a narrow grain size distribution. The high crystallinity results in a relatively low specific surface area. This property enables a low increase in viscosity at high filler loadings.

HeBoFill® CL-ADM 020 is a Boron Nitride powder with a high level of purity, high crystallinity and excellent free flowing characteristics. It is particularly suitable for use as filler and additive in polymer materials to improve their thermal conductivity.

HeBoFill® CL-SP 015 is a very pure boron nitride powder with an average particle size of 15 μm. This boron nitride grade has a low specific surface area combined with high crystallinity. This quality is particularly suitable as a filler and additive in polymers to increase the thermal conductivity without affecting the electrically insulating properties.

HeBoFill® LL-SP 050 is a Boron Nitride powder with good crystallinity and a narrow grain size distribution. Its fine particle size and low agglomerate content makes it suitable for a wide variety of applications.

HeBoFill® CL-SP 009 is a pure boron nitride powder with high crystallinity and an average particle size of 9 μm. Due to the pronounced platelet structure and the low specific surface area, this powder is very well suited as a filler and additive for plastics, as well as for a wide range of other applications.

HeBoFill® CL-SP 035* is a high-purity boron nitride powder with a very distinct crystal structure and single crystallites in the range of 35 pm. It is further characterized by its low density and intrinsic high thermal conductivity. Since large crystallites conduct heat much faster, it is predestined for use as a filler and additive in plastics. Thereby, their thermal conductivity is significantly increased, while simultaneously maintaining good electrical insulation.

HeBoFill® CL-SP 045 is a pure Boron Nitride powder with a coarse grain size distribution. Its average particle size is 45 μm. The extremely low specific surface area allows high filler loadings with a minimum viscosity increase. It is particularly suitable as a filler in polymers, allowing the thermal conductivity to be increased without affecting the electrically insulating properties.

HeBoFill® BL-SP 040 is a Boron Nitride powder exhibiting a defined platelet structure and high purity. Virtually no formation of agglomerates. As a filler and additive it improves the temperature resistance and the thermal conductivity.