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HexFlow® RTM651

1 of 5 products in this brand
HexFlow® RTM651 is a one-component modified bismaleimide for resin transfer molding (RTM). Upon heating to 100-120°C the resin will become a low viscosity homogeneous liquid that has a long pot-life and processes easily. Postcure can be carried out free standing. HexFlow RTM651 is a premixed bismaleimide system for service temperature to 232°C.

Polymer Name: Polybismaleimide

Chemical Family: Bismaleimides (BMI)

Processing Methods: Resin Transfer Molding (RTM)

Technical Data Sheet
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Identification & Functionality

Chemical Family
Polymer Name
Composite Materials Functions

Features & Benefits

Features
  • Monocomponent system
  • High glass transition temperature (285°C)
  • Excellent elevated temperature properties
  • Easy to process
  • Free standing postcure
  • Short, simple cure cycles

Applications & Uses

Composites Processing Methods
HexFlow® RTM651 Injection Conditions
  • Preheat resin to 110°C
  • Preheat mold to 150°C
  • Heated transfer lines should be used, 110°C recommended
  • Inject the resin into the mold at 2-3 bars (minimum)

Cure Cycle
4 hours at 191°C, 5.86 bars optimal, 3.10 bars minimum

Postcure Cycle

  • A postcure is required to achieve the glass transition temperature and at-temperature properties shown in chart.
  • Typical postcure of 16 hours at 232°C or 6-8 hours at 245°C, free standing.
  • Ramp temperature from ambient to 191'°C at a rate of 3-6°C/minute and at a rate of 0.6-1.2°C/minute above 191°C.

Properties

Mechanical Properties
ValueUnitsTest Method / Conditions
Tensile Strength Room Temp. (Dry)72.4MPa-
Tensile Modulus Room Temp. (Dry)4.08GPa-
Tensile Starin Room Temp. (Dry)21.9%-
Flexural Strength Room Temp. (Dry)141MPa-
Flexural Modulus Room Temp. (Dry)4.22GPa-
Flexural Strength 177 (Dry)109MPa-
Flexural Modulus 177 (Dry)31.4GPa-
Neat Resin Properties
ValueUnitsTest Method / Conditions
Specific gravity1.25--
Tg (Dry)285°C-
Tg (Wet)219°C-
Fracture Toughness, K1C1.05Mpa-
Pot Life
Temperature (°C) Viscosity
0 Hour 1 Hour
110 80 mPas 120 mPas
120 50 mPas 67 mPas

Minimum viscosity 15 mPas at 156°C

Laminate Mechanical Properties
|RTM651/3K 193 gsm PW STD MOD Carbon Test Coupon Conditioning Test Temp (°C) UOM Results
Tension 0° Dry 23 Strength MPa 782
Modulus GPa 62.3
Open Hole Tension "/ 14 days H20 70°C 175 Strength MPa 291
14 days H20 70°C 190 Strength MPa 298
70°C 85%RH sat 175 Strength MPa 286
70°C 85%RH sat 190 Strength MPa 288
In Plane Shear* Dry 23 Strength MPa 87.3
175 Modulus GPa 4.89
14 days H20 70°C 175 Strength MPa 65
Modulus GPa 2.96
70°C 859%6RH sat 175 Strength MPa 65
Modulus msi 3.23
ILSS Dry 23 Strength MPa 58.1
14 days H0 70°C 175 Strength MPa 33.2
70°C 85 %RH sat 175 Strength MPa 37.5

Laminates were cured and postoured per recommended cure cycle.

*Nominal cured ply thickness 0.21 mm

**Width=36 mm
Note: Fibro used-Tonax HTA 3K

Gel Time
Temperature (°C) 150 160 177 200
Gel Time (min) 98 62 23 5

Gel time measured on a hot plate.

Technical Details & Test Data

Viscosity Profiles

Dynamic Viscosity Analysis

HexFlow® RTM651 - Viscosity Profiles Isothermal Viscosity Analysis -110°C

HexFlow® RTM651 - Viscosity Profiles  - 1Isothermal Viscosity Analysis 120°C

HexFlow® RTM651 - Viscosity Profiles  - 2

Storage & Handling

Shelf Life
1 Year ( -18°C)