Products

HexFlow® VRM37 is a 350°F curing, two-part, mid-toughened epoxy resin, specifically developed to meet the demanding requirements of structural aerospace resin transfer molding (RTM) and vacuum assisted resin transfer molding (VARTM) applications. This epoxy system supports service temperatures up to 250°F. HexFlow® VRM37 Part A is a light amber color; HexFlow® VRM37 Part B is a dark purple color.

HexFlow® RTM6-2 resin is the bi-component version of HexFlow® RTM6 resin. Delivered as two different components, HexFlow® RTM6-2 resin provides several benefits over HexFlow® RTM6: air shipment is allowed, storage at 23± 3°C for 12 months, and bigger packages are possible (up to 378 kg). HexFlow® RTM6-2 resin is chemically the same as RTM6 resin and has the same high performance after mixing Part A and Part B. Their mixing ratio in weight is Part A : Part B (100 : 68.1). After mixing Part A and Part B, service temperatures from -60°C up to 120°C and cycle processing flexibility make HexFlow® RTM6 resin ideal for primary & secondary aerospace structures. Due to the low viscosity of HexFlow® RTM6 resin, there are long injection windows to facilitate large-parts manufacturing. Mixed HexFlow® RTM6-2 resin can be used with a wide range of HexForce®, HiTape® and HiMax™ reinforcements. If needed, binders are also available and fully compatible with HexFlow® RTM6-2 resin. They provide dimensional stability to the reinforcement and ease preforming processes. Mixed HexFlow® RTM6-2 resin, when combined with HiTape® & HiMax™ reinforcements, has comparable mechanical properties to the latest generation prepregs.

HiMax™ 8gsm DPA (Dot Pattern Adhesive) products are designed to help composite manufacturers maintain the desired position of the reinforcement prior to resin introduction, particularly in closed mold processes such as vacuum infusion and resin transfer molding. HiMax™ DPA was developed to provide the optimal level of tack while keeping additional weight to a minimum. Using DPA in conjunction with HiMax™ fabrics allows the user to easily position and re-position the individual layers of their laminate stack before resin is introduced. Conformance to tight radii and complex mold geometry is also aided by DPA.

HexFlow® RTM6 is aerospace qualified resin system specially developed for Direct Processes applications, such as Infusion and RTM. Its service temperatures from - 60°C up to 120°C and cycle processing flexibility make HexFlow® RTM6 ideal for primary & secondary aerospace structures. Long injection windows due to HexFlow® RTM6 low viscosities are easily reached facilitating large parts manufacturing. HexFlow® RTM6 resin can be used in combination with a wide range of HexForce®, HiTape® and HiMax™ reinforcements. If needed, binders are also available and fully compatible with HexFlow® RTM6. They provide easy preforming properties and reinforcement dimensional stability. HexFlow® RTM6 when combined with HiTape® & HiMax™ has comparable mechanical properties to latest generation prepregs.

HexFlow® RTM651 is a one-component modified bismaleimide for resin transfer molding (RTM). Upon heating to 100-120°C the resin will become a low viscosity homogeneous liquid that has a long pot-life and processes easily. Postcure can be carried out free standing. HexFlow RTM651 is a premixed bismaleimide system for service temperature to 232°C.

HiMax™ 3gsm DPA (Dot Pattern Adhesive) products are designed to help composite manufacturers maintain the desired position of the reinforcement prior to resin introduction, particularly in closed mold processes such as vacuum infusion and resin transfer molding. HiMax™ DPA was developed to provide the optimal level of tack while keeping additional weight to a minimum. The novel application process allows just 3 grams per m2 of adhesive to be applied to the specified fabric. Using DPA in conjunction with HiMax™ fabrics allows the user to easily position and re-position the individual layers of their laminate stack before resin is introduced. Conformance to tight radii and complex mold geometry is also aided by DPA.

HexFlow® RTM230 ST is a monocomponent resin specifically developed for aerospace resin transfer molding (RTM) applications where high toughness is required. HexFlow® RTM230 ST is a premixed epoxy system for service temperatures up to 110°C. At room temperature, it is a gray colored paste but its viscosity decreases quickly by increasing the resin temperature.