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HexPly® F650 is a bismaleimide resin that cures via an additional/free radical mechanism resulting in a crosslinked thermoset system with no condensation by-products. HexPly® F650 was developed by Hexcel to overcome existing limitations for use on complex structures and ducting in advanced military aircraft, helicopters, and many other high temperature applications. HexPly® F650 simplifies fabrications and delivers a more costeffective end product.

Polymer Name: Thermoset Polyimide (PI)

Functions: Prepreg

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Chemical Family
Composite Materials Functions

Features & Benefits

Product Highlights

A New Level of Workability

Designers can now specify BMI in structures with extreme curvature without performance worries because HexPly® F650 offers excellent tack, handling characteristics, and straightforward layup and processing. In addition, there is no unpleasant odor and no need for cumbersome layup aids.

Longer Out Time

You have more time to work with HexPly® F650. The out time for successful structure layup is measured in weeks rather than days. And that’s time that allows for more complex applications.

Straight-Up Curing

You won’t have to babysit HexPly® F650. Employ simple, straight-up cure cycle followed by conventional postcure and that’s it. HexPly® F650’s unique resin chemistry also eliminates micro-cracking. HexPly® F650 delivers consistent void-free laminates time after time.

Superior Burn Characteristic

HexPly® F650 takes the heat, remaining structurally stable up to 600°F (316°C) dry, and 450°F (232°C) wet. It emits minimal visual smoke and possesses excellent fire barrier properties. HexPly® F650 is currently being evaluated for a variety of fire containment structures.

Desirable Electrical Performance

HexPly® F650 possesses excellent electrical properties, characteristic to polyimide resin systems, and is the ideal candidate for radome and other electronic applications.

  • Hexcel BMI capability
  • Background
  • Introduced first BMI prepreg to industry (1970)
  • Synthesized base BMI monomer
  • 20-Year production history
  • New more optimum BMI (HexPly® F650) introduced in 1985 Copyright
Advantages
  • Viscous, homogeneous
  • Simple, adjustable, reaction kinetics
  • No resin advancement at room temperature
  • Simple processing and impregnation
  • High Tg relative to post cure
  • Dimensionally stable at greater than 500°F (260°C)
  • High laminate mechanical strengths and strains
  • Modest cost
  • Non-micro cracking for woven laminates

Applications & Uses

Properties

Physical Form
Neat Resin Properties
ValueUnitsTest Method / Conditions
Specific gravity1.27
Tg (Dry)min. 600 (316)°F (°C)
Equilibrium moisture absorption4.3%
Fracture Toughness, K1C0.51 (0.46)ksi (Mpa)
Strain energy release rate, G1C0.38 (0.067)in-lb/in2 (KJ/m2)
Linear Coefficient of Thermal Expansion2.7 x 10–5 (4.9 x 10–5)in/in/°F (cm/cm/°C)
Gel time at 350°F (177°C)min. 5-8

Storage & Handling

Storage

HexPly® F650 prepreg should be sealed in a polyethylene bag and refrigerated, preferably below 32°F (0°C). Following removal from refrigerated storage, allow the prepreg to reach room temperature before opening the polyethylene bag to avoid moisture condensation.
Shelf life: 12 months at 0°F (–18ºC), 6 months at 40°F (4ºC) (maximum, from date of manufacture).

Product Handling and Safety

Hexcel recommends that customers observe established precautions for handling polyimide resins and fine fibrous materials. Operators working with this product should wear clean, impervious gloves to reduce the possibility of skin contact and to prevent contamination of the material.