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HexFlow® RTM6 is aerospace qualified resin system specially developed for Direct Processes applications, such as Infusion and RTM. Its service temperatures from - 60°C up to 120°C and cycle processing flexibility make HexFlow® RTM6 ideal for primary & secondary aerospace structures. Long injection windows due to HexFlow® RTM6 low viscosities are easily reached facilitating large parts manufacturing. HexFlow® RTM6 resin can be used in combination with a wide range of HexForce®, HiTape® and HiMax™ reinforcements. If needed, binders are also available and fully compatible with HexFlow® RTM6. They provide easy preforming properties and reinforcement dimensional stability. HexFlow® RTM6 when combined with HiTape® & HiMax™ has comparable mechanical properties to latest generation prepregs.

Polymer Name: Epoxy Resins & Compounds

Chemical Family: Epoxy & Epoxy Derivatives

Processing Methods: Resin Film Infusion (RFI), Resin Transfer Molding (RTM)

Technical Data Sheet

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Identification & Functionality

Composite Materials Functions

Features & Benefits

Advantages
  • Qualified and well-known for Vacuum Infusion & RTM process
  • High glass transition temperatures : dry*: Tg>200°C; wet*: Tg>160°C
  • Low moisture absorption: 2.0 – 3.0 %
  • < 100 mPa.s at process temperatures
  • Mechanical properties similar to latest generation prepregs when combined with HiTape® & HiMax™ reinforcements
  • Flexible processing and cure cycles

Applications & Uses

Processing
  • Defrosting: 24h at 23°C ± 5°C (10kg)
  • Process parameters (Infusion or RTM): 
  1. Preheat resin at 80°C (please refer to “Hexcel RTM6 Safety Processing Guidelines” document for maximum preheating time)
  2. Mold temperature: between 120°C and 140°C, at constant temperature
  3. Injection / infusion lines: 90 – 110°C
  4. Mold / bagging leakage: below 15 mbar in 5min
  5. Vacuum Infusion: below 5 mbar
  6. RTM Piston Pressure: atm to 5 bars
  • Cure cycle: 90 min minimum at 180°C - no post cure required (degree of cure: α > 90%)

Properties

Mechanical Properties
ValueUnitsTest Method / Conditions
K1C (-m½)0.6MPa
Density1.14g/cm3
Coefficient of Thermal Expansion -50°C to 20°C50μm/m°C
Coefficient of Thermal Expansion 20°C to 100°C60μm/m°C
Coefficient of Thermal Expansion 100°C to 180°C75μm/m°C
Moisture uptake2.0 – 3.0%
Ultimate strength 23°C ± 5°C (Dry)320MPaASTM D695
Ultimate strength 23°C ± 5°C (Wet)300MPaASTM D695
Modulus 23°C ± 5°C (Dry)3.2GPaASTM D695
Modulus 23°C ± 5°C (Wet)3.1GPaASTM D695
Ultimate strength 120°C ± 5°C (Dry)210MPaASTM D695
Ultimate strength 120°C ± 5°C (Wet)175MPaASTM D695
Modulus 120°C ± 5°C (Dry)2.8GPaASTM D695
Modulus 120°C ± 5°C (Wet)2.3GPaASTM D695
Ultimate strength 23°C ± 5°C (Dry)90MPaASTM D638
Ultimate strength 120°C ± 5°C (Wet)40MPaASTM D638
Modulus 23°C ± 5°C (Dry)3MPaASTM D638
Modulus120°C ± 5°C (Wet)1.9MPaASTM D638
Laminate properties
ValueUnitsTest Method / Conditions
Compression 0°, Modulus (120°C ± 5°C, Dry)62GPaEN2850A1
Compression 0°, Modulus (120°C ± 5°C, Wet)63GPaEN2850A1
Compression 0°, Modulus (23°C ± 5°C, Dry)59.1GPaEN2850A1
Compression 0°, Modulus (23°C ± 5°C, Wet)62.2GPaEN2850A1
Compression 0°, Ultimate strength (120°C ± 5°C, Dry)550MPaEN2850A1
Compression 0°, Ultimate strength (120°C ± 5°C, Wet)430MPaEN2850A1
Compression 0°, Ultimate strength (23°C ± 5°C, Dry)710MPaEN2850A1
Compression 0°, Ultimate strength (23°C ± 5°C, Wet)540MPaEN2850A1
Compression 90°, Modulus (120°C ± 5°C, Dry)60GPaEN2850A1
Compression 90°, Modulus (120°C ± 5°C, Wet)61GPaEN2850A1
Compression 90°, Modulus (23°C ± 5°C, Dry)60.7GPaEN2850A1
Compression 90°, Modulus (23°C ± 5°C, Wet)61GPaEN2850A1
Compression 90°, Ultimate strength (120°C ± 5°C, Dry)530(MPa)EN2850A1
Compression 90°, Ultimate strength (120°C ± 5°C, Wet)640(MPa)EN2850A1
Compression 90°, Ultimate strength (23°C ± 5°C, Dry)640(MPa)EN2850A1
Compression 90°, Ultimate strength (23°C ± 5°C, Wet)530(MPa)EN2850A1
Compression after Impact, Delaminated Area (23°C ± 5°C, Dry, 30J impact)970(mm²)ASTM D7136/ D7137
Compression after Impact, Indent Depth (23°C ± 5°C, Dry 30J impact)0.5(mm)ASTM D7136/ D7137
Compression after Impact Gross Strength (23°C ± 5°C, Dry 30J impact)215MPaASTM D7136/ D7137
In Plane Shear, Modulus (120°C ± 5°C, Dry)3.4GPaEN6031
In Plane Shear, Modulus (120°C ± 5°C, Wet)2.9GPaEN6031
In Plane Shear, Modulus (23°C ± 5°C, Dry)3.8GPaEN6031
In Plane Shear, Modulus (23°C ± 5°C, Wet)4.1GPaEN6031
In Plane Shear, Ultimate Strength (120°C ± 5°C, Dry)85MPaEN6031
In Plane Shear, Ultimate strength (120°C ± 5°C, Wet)70MPaEN6031
In Plane Shear, Ultimate strength (23°C ± 5°C, Dry)115MPaEN6031
In Plane Shear, Ultimate strength (23°C ± 5°C, Wet)95MPaEN6031
Gel Point
Temperature Gel time: G’ & G’’ crossover Time to reach 1000 mPa.s Time to reach 200 mPa.s
(°C) (hh:min) (hh:min) (hh:min)
80 > 15:00 > 15:00 Viscosity > 200mPa.s
90 > 15:00 12:00
100 11:30 8:00 5:30
110 7:30 5:00 4:00
120 4:00 3:00 2:30
130 2:40 2:00 1:40
140 1:40 1:20 1:10
150 1:00 0:55 0:50
160 0:45 0:40 0:35
170 0:30 0:25 0:25
180 0:20 0:20 0:15
DMA (EN6032)
Tg (°C) Dry Wet
Onset 210 175
Loss 215 190
Tanδ 230 195
Testing Conditions

Uncured resin data

Isothermal viscosities: EN6043

  • Gap: 0.5mm
  • Shear rate: 10 rad/s
  • Strain: 4%

Rheology profile: EN6043

  • Gap: 0.5mm
  • Shear rate: 10 rad/s
  • Strain: 4%
  • Temperature range: from 30°C to 250°C

Cured resin data

K1c: ASTM D5045

Density: ISO1183

DMA: EN6032

  • Mode: fixed frequency, simple cantilever
  • Amplitude: 15µm
  • Frequency: 1Hz
  • Heating rate: 3°C/min
  • Temperature range: 30°C to 250°C

Standard DSC: EN6041

  • Heating rate: 10°C/min
  • Temperature range: from -60°C to 350°C

Modulated DSC:

  • 2 heating cycles: from -10°C to 110°C then from -50°C to 280°C at 2°C/min, Cp measured on second heating rate
  • Oscillation: +/-1°C
  • Period: 120s

Compression : ASTM D695
Tensile : ASTM D638

Technical Details & Test Data

Uncured Resin Properties

Viscosity

HexFlow® RTM6 - Uncured Resin PropertiesFigure 1: Rheology profile of HexFlow® RTM6 resinHexFlow® RTM6 - Uncured Resin Properties - 1

Figure 2: Rheology profile of HexFlow® RTM6 resin

 

Thermokinetics

Standard DSC parameters

Tg midpoint (°C) Enthalpy (J/g) T peak (°C) T onset (°C)
-15 450 240 215

 

HexFlow® RTM6 - ThermokineticsFigure 3: Standard DSC HexFlow® RTM6 resin

HexFlow® RTM6 - Thermokinetics - 1

Figure 4: Specific heat of HexFlow® RTM6 resin

HexFlow® RTM6 - Thermokinetics - 2

Figure 5: Standard DSC at various heating rates of HexFlow® RTM6 resin

Storage & Handling

Shelf Life
15 days (20 - 26°C), 9 months (-18°C)