- Functions:Laser Marking Additive
- End Uses:Fuse Box
The laser direct structuring process allows the manufacturing of electronic equipment directly onto a 3-dimensional polymeric or ceramic substrate without the use of a printed circuit board. Generating the electrical circuitry directly onto the polymer or ceramic part allows a high packing of electronic components and helps to miniaturize the parts. LDS additives, for example our StanoStat CP5C, are incorporated directly into the polymer. After injection molding, the resulting part is marked with a laser engraving the circuit onto the surface. This then undergoes metallisation. The metal is only deposited on the areas that have been marked by the laser. Thereafter, the components can be mounted.