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M.G. Polyblends HSC-T-384

M.G. Polyblends HSC-T-384 is pioneer in developing heat shrinkable, heat curable molding compounds based on polyolefin material containing some specialty chemicals and mold release additives. Curing material (Peroxide particularly dicumyl peroxide) has not been included in this product (HSC-T-384) and hence it does not loses its processing as well as electrical properties during storage. That means it can be stored for any period of time. Users have to incorporate peroxide during sheeting of the material on a Two Roll Mill or mix in a mixer prior to use in Injection Molding. It offers excellent weathering and other electrical properties required in cable jointing applications. This compound offers antitracking properties in the molded product. Outstanding properties of this compound makes an excellent choice for the molding of heat shrinkable Rain Sheds, Cable Breakout Boots and End Caps.

Processing Methods: Compression Molding, Injection Molding

Carrier: Polyolefins, Resin-based, Thermoplastic Polyolefins (TPO)

Technical Data Sheet
  • TypeDocument Name
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Knowde Enhanced TDS

Identification & Functionality

Carrier

Polyolefins,

Resin-based,

Thermoplastic Polyolefins (TPO)

Plastics & Elastomers Functions

Mold Release Agent,

Release Agent

Technologies

Elastomers,

Plastics

Product Families

Elastomers — Elastomer Additives

Performance Additives

Plastics — Masterbatches

Additive Masterbatches

Plastics — Polymer Additives

Performance Additives

Features & Benefits

Materials Features

Good Electrical Properties,

Good Heat Shrinkability,

Good Weather Stability

Applications & Uses

Markets

Electrical & Electronics

Applications

Electrical & Electronics — Wire & Cable

Jacketing & Insulation,

Other Wire & Cable Applications

Cure Method

Heat Cure

Plastics & Elastomers Processing Methods

Compression Molding,

Injection Molding

Properties

Physical Form

Granules,

Masterbatch,

Solid

Appearance
Plastic Granules
Typical Properties
ValueUnitsTest Method / Conditions
Bulk Density0.708gm/ml-
Carrier ResinPolyolefin--
MFI (190°C, 2.16 Kg)3.6-ASTM D-1238
Moisture Contentmin. 0.2%ASTM D-570
Specific Gravity1.23-ASTM D-792

Technical Details & Test Data

Recommended Processing Condition

For Compression Molding

1. Sheeting on Two Roll mill

Compound has to be milled on a two roll mill ( For better mixing and proper rolling of the compound, rolls of the two roll mill should be at 85-900 C). Once the Proper band is formed , add approx 0.6% of dicymyl peroxide (purity level 98-99%) on the material and mix again properly till homogeneously mixed roll sheet is formed.

2. Compression/ Press molding

  • Mold Temperature : 70-75 °C
  • Crosslinking/Curing time : 80-10minutes

3. Shrink Property of the molded Product

  • Shrink Temperature :100-120°C
  • Shrink Ratio: 3:1

For Injection Molding

I . Mix 0.6% (Purity level 98-99%) dicumyl peroxide with this compound ( preferably slightly heated) in a ribbon or similar type Of blender. Then these granules can be directly put into the injection molding machine With heated molds to make heat shrinkable end caps, breakout boots and raid sheds.

1.Shrink Property of the molded Product

  • Shrink Temperature :100-120°C
  • Shrink Ratio: 3:1

2.  Mold Temperature : 70-75 °C

3. Barel Temperature :100-120°C

 

Packaging & Availability

Packaging Type

Bags

Packaging

HDPE woven Sacks of 25kgs