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NGAC P907-30 is a controlled flow encapsulant with a high viscosity designed for microelectronics applications requiring low shrinkage and high reliability performance.

Product Type: Encapsulant, Encapsulant Paste & Ink, Potting Compound

Application Area: Printed Electronics

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Advantages

 It is highly resistant to humidity and will withstand reflow temperatures up to 260C. NGAC P907-30 features the following characteristics that
enable ease of use.

Applications & Uses

Application Area
Applications

Uses include protecting wire bonds and bare die and other micro-electronic structural assembly applications. NGAC P907-30 has a low CTE resulting in low shrinkage upon cure and no stress to substrates.

Properties

Color
Typical Properties
ValueUnitsTest Method / Conditions
Specific Gravity1.8
Hardness95DShore D
Operating Temperature-40 to 260°C
Working Life***24h

Technical Details & Test Data

Cure Schedule
Temperature 100°C PLUS 150°C
Time 30 minutes   45 minutes
OR
Temperature 150°C
Time 45 minutes

***Working life is subjective to application requirements.

Storage & Handling

Storage Requirements

NGAC P907-30 is packaged in pre-mixed and frozen syringe. It must be shipped in dry ice and stored in a freezer at -40C or colder.
Shelf life of each lot will be exactly 6 months from date of manufacture with storage at -40C Minimum.