NextGen Adhesives

The NGAC TC907-07 adhesive is thermally conductive and electrically insulating, and it can be cured at room temperature. It was created for the purpose of assembling heat sensitive components onto printed circuit boards. It is recommended for any application that necessitates strong adhesive bonds as well as excellent thermal transfer. NASA outgassing and weight loss requirements are met by NGAC TC907-07.

NGAC P907-30 is a controlled flow encapsulant with a high viscosity designed for microelectronics applications requiring low shrinkage and high reliability performance.

NGAC P907-01 is a heat cured, low viscosity, rapid curing epoxy adhesive system designed specifically for use in the fiber optic industry.

NGAC P910-04 is a high viscosity, controlled flow \sencapsulant designed for microelectronics applications \srequiring low shrinkage and high reliability performance.

NGAC G907-52 is a room temperature curable epoxy adhesive with a low viscosity. This two-part system has a strong adhesion to glass, ceramics, most metals, and plastics.

The NGAC EC907-34 is a two-part, electrically conductive silver-filled epoxy adhesive that cures at room temperature. It was created for applications that require superior mechanical and electrical properties.