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NGAC P910-04 is a high viscosity, controlled flow \sencapsulant designed for microelectronics applications \srequiring low shrinkage and high reliability performance.

Product Type: Encapsulant, Encapsulant Paste & Ink, Potting Compound

Application Area: Printed Electronics

Technical Data Sheet
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Identification & Functionality

Features & Benefits

Advantages

It is highly resistant to humidity and will withstand reflow temperatures up to 260C. NGAC P910-04 features the following characteristics that enable ease of use.

Applications & Uses

Application Area
Applications

Uses include protecting wire bonds and bare die and other micro-electronic structural assembly applications. NGAC P910-04 has a low CTE resulting in low shrinkage upon cure and no stress to substrates

Properties

Color
Typical Properties
ValueUnitsTest Method / Conditions
Viscosity (CP52, 1rpm 25°C)300000.0cpsASTM-D1084
Specific Gravity1.8-ASTM-D1875
Hardness95.0Shore DASTM-D2240
Glass Transition, (Tg)130.0°CASTM-E1356
CTE (Alpha1, -40 to 100°C)20.0ppm/°CASTM-E831
CTE (Alpha2, 150°C to 220°C)68.0ppm/°CASTM-E831
Operating Temperature-40 to 260°CTP-305
Working Life***1.5-3hoursTP-201

Technical Details & Test Data

Cure Schedule
Temperature 100°C PLUS 150°C
Time 30 minutes   45 minutes
OR
Temperature 150°C
Time 45 minutes

***Working life is subjective to application requirements.

Storage & Handling

Storage Requirements

NGAC P910-04 is packaged in pre-mixed and frozen syringe. It must be shipped in dry ice* and stored in a freezer. The optimum storage temperature is -60˚C to -70˚C and the minimum storage temperature recommended is -57˚C.
*Temperature during shipment should be maintained at -40˚C or colder with dry ice.
Shelf life of each lot will be exactly 6 months from date of manufacture with storage at -57˚C minimum.