company tower banner
NextGen Adhesives Company Logo
The NGAC TC907-07 adhesive is thermally conductive and electrically insulating, and it can be cured at room temperature. It was created for the purpose of assembling heat sensitive components onto printed circuit boards. It is recommended for any application that necessitates strong adhesive bonds as well as excellent thermal transfer. NASA outgassing and weight loss requirements are met by NGAC TC907-07.

Product Type: Conductive Adhesive

Application Area: Printed Electronics

Cure Method: Air Dry

Compatible Substrates & Surfaces: Glass, Metal, Plastics

Technical Data Sheet
  • TypeDocument Name
View All Documents

Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Advantages

NGAC TC907-07 features the following characteristics that enable ease of use.

Applications & Uses

Application Area
Compatible Substrates & Surfaces
Cure Method
Applications

NGAC TC907-07 provides strong and high impact bonds which improve heat transfer while maintaining electrical insulation. It bonds to a wide range of substrates including metals, glass and plastics. The NGAC TC907-07 has a low coefficient of thermal expansion and will provide excellent resistance to mismatched substrates and very low shrinkage. Additionally, the NGAC TC907-07 is highly resistant to chemicals.

Properties

Color
Typical Properties
ValueUnitsTest Method / Conditions
Mixed Viscosity (CP52,10rpm)10000.0cps-
Specific Gravity2.3--
Mix Ratio (Weight, R/H)100/9.5--
Hardness90.0Shore D-
Operating Temperature-70 to +125°C-
Glass Transition Temperature60.0--
Thermal Conductivity, W/M/°0.96W/M/°K-
CTE2.5e-05in/°C-
Lap Shear (Alum to Alum)3000.0psi-
NASA OutgassingPasses--

Technical Details & Test Data

Cure Schedule
Temperature 25°C 65°C
Time 24 hours 2-4 hours

Storage & Handling

Pot Life
40 minutes