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Nils Malmgren AB NM ME 585

NM ME 585 is a low viscosity, room temperature curing solvent free epoxy resin with all-round properties, i.e. modeling and production of molds.

Polymer Name: Epoxy Resins & Compounds

Chemical Family: Epoxy & Epoxy Derivatives

Processing Methods: Hand Lay-up, Vacuum Infusion Processing (VIP)

End Uses: Mold Making

Technical Data Sheet
  • TypeDocument Name
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Knowde Enhanced TDS

Identification & Functionality

Composite Materials Functions

Applications & Uses

Markets
Plastics & Elastomers End Uses
Typical applications
  • Producing of epoxy laminates
  • Reparation of damages to laminates
  • Adhesive
  • Backing
Use

NM ME 585 can be used for laminating as well as adhesive. It can be filled with sand or aluminum powder for backing. NM ME 585 has a friendly environment profile, and contains no unreactive products labeled as hazardus to the environment.

Properties

Chemical Resistance
Typical Properties
ValueUnitsTest Method / Conditions
Cleaning SolventAcetone
ResinNM ME 585
HardenerNM Harderner 586
Mixing Ratio (Weight, Volume)100 - 44 (100 - 51.2)
Density1114kg/m3
Viscosity (25°C)650mPa·s
Pot Life (100g 20°C)50hour
Potlife 100G 20°C (+10% Accelerator 254)12minutes
Compressive Strength105MPa
Tensile Strength45MPa
Flexural Strength106MPa
Modulus of Elasticity[Flexural]3.1GPa
HDT45°C

Storage & Handling

Pot Life
 % Accelerator 254   Potlife (Minutes)  
 0   50 
 1.0   44 
 2.0   37 
 3.0   33 
 4.0   28 
 5.0   24 
 6.0   21 
 7.0   18 
 8.0   16 
 9.0   14 
 10.0   12 

Potlife for NM ME 585 / NM Hardener 586 with different amounts of NM Accelerator 254. The values are for 100 gms of NM ME 585 / NM Hardener 586 with a initial temperature of 20°C. The percent adding is calculated as ex. 100 gms + 1 gm.

NM ME 585 has a quite long pot life, and produce very little heat build-up. It can be accelerated up to 10% with NM Accelerator 254. NM ME 585 can be thixotropated with NM Filler 51 for the use as adhesive. The wetting is good to most substrates.