Products

NexSil™ 85-40 is an alkaline dispersion of 40 - 60 nm colloidal silica at a 40% SiO2 concentration in water. The particles are negatively charged. The product can be used in paper, steel and precision polishing applications where large particle size colloidal silica is required. NexSil 85-40 is a good choice for sapphire polishing and other specialty wafer polishing applications. NexSil 85-40 provides good balance between removal rate and surface finish. Consult NYACOL® for recommendations on starting conditions.

NexSil™ 125-40 is an alkaline dispersion of 70 - 90 nm colloidal silica at a 40% SiO2 concentration in water. The particles are negatively charged. The product can be used in paper, steel and precision polishing applications where large particle size colloidal silica is required. NexSil 125-40 is a good choice as an abrasive for Si wafer stock-polish, sapphire wafer polishing and other hard substrate polishing. NexSil 125-40 is also excellent for paper antiskid and other antiblocking applications where the large particle colloidal silica is used. Consult NYACOL® for recommendations on starting conditions.