Products

Polycarbonate - Thermally and electrically conducting grade with high HDT and improved processability.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP105/X3 BK is a black colored, thermally conductive polycarbonate compound, combining excellent thermal conductivity with high HDT and good processability.Applications: Housings for power components. Encapsulation/housings for bobbins, actuators, and coils. IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. LED lighting assemblies.

Thermally conductive Nylon 6,6.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP113/X5 is a thermally conductive, electrically insulating polycarbonate compound, combining good thermal conductivity with high HDT and good processability.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP105/X3 BK is a black colored, thermally conductive polycarbonate compound, combining excellent thermal conductivity with high HDT and good processability.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a thermally conductive polycarbonate alloy, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds.

PPS based, thermally conducting, electrically insulating grade with improved processability.

Nemcon™ E PK DP104 is a carbon fiber-reinforced polyetheretherketone, characterized by very high strength, stiffness, consistent moldability, and exceptional thermal resistance.

Thermally conductive Polycarbonate

Polycarbonate/Acrylonitrile Butadiene Styrene, thermally and electrically conducting grade.

PPS based, thermally conducting, electrically insulating grade with improved processability.

Glass reinforced (30 %) Polyether Sulfone, excellent chemical and electrical resistance, high stiffness, modulus and HDT.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a natural, thermally conductive polycarbonate, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds.Applications: Housings for power components. Encapsulation/housings for bobbins, actuators, and coils. IC thermal management components, such as heat sinks, heat spreaders, or heat pipes. LED lighting assemblies.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PO DP117/X2 is a thermally conductive polyetheretherketone, offering excellent chemical resistance, good stiffness and high HDT. It should be used in demanding applications where thermal management must be accomplished in harsh environments.

Polycarbonate Alloy - High temperature (HDT), high Impact, with excellent short and long term heat stability.

Thermally Conductive Polyetheretherketone, excellent chemical, high stiffness, modulus and HDT.

Glass reinforced (20 %) Polyether Sulfone. Excellent chemical and electrical resistance, high stiffness, modulus and HDT.

PET - Fiber Grade with ESD Range Conductivity with improved processability.

Polyether Sulfone Resin - Medium Viscosity, un-reinforced standard grade for easy injection molding.

PC based, thermally conducting, electrically insulating grade with improved processability.

Thermally conductive Polyphenylene Sulfide

Nemcon H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon H ABS DP116P is a thermally conductive, electrically insulating ABS compound, combining thermal conductivity with good HDT and processability.

Polycarbonate/Acrylonitrile Butadiene Styrene, thermally and electrically conducting grade.

Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PA DP117/X3 is a thermally conductive polyetheretherketone, offering excellent chemical resistance, good stiffness and high HDT. It should be used in demanding applications where thermal management must be accomplished in harsh environments.

PC Alloy - ESD Range Electrical Conductivity with High HDT and improved processability.

Glass reinforced (30 %) - High Temperature Polyamide Alloy, excellent chemical and electrical resistance, high stiffness, modulus and HDT.

Glass reinforced (13 %) High Temperature Polyamide - Blow Molding grade with excellent chemical resistance, improved flow and high HDT.