Kimura

Precision Polymer Engineering Brand

Products:3

A unique range of fully organic elastomers ideally suited to thermal, dynamic and specific plasma processes where radical concentrations are generally lower or where inorganic filler systems are undesirable. The Kimura® range of high performance elastomer materials utilize a controlled molecular architecture which provides a unique self-reinforcing polymer structure, providing improved chemical resistance without the use of inorganic fillers of any kind. This high purity material breaks new ground in elastomer technology, developed specifically for aggressive chlorine and CxFy based semiconductor applications. Kimura® elastomers span the range of fluoro and perfluoro (FKM and FFKM) materials and includes unique hybrid elastomers, specifically developed by PPE, for the semiconductor industry, to offer a step-change in sealing performance, surpassing what has previously been achievable for fully organic materials. The high purity of the polymer combined with the absence of inorganic fillers makes Kimura® materials suitable for processes involving lower feature sizes.

View All Kimura Products

Kimura® K13X

Polymer Name:Perfluoroelastomer (FFKM)
Features:High Performance, High Strength, Low CLTE, High Purity, Low Outgassing, Low Compression Set, Low Friction

A dark brown high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for critical semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments.Key Attributes Exceptionally pure - does not contain any fillers which may cause particulation problems. Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries. Exceptionally low plasma etch rate Low thermal expansion Retro-fits existing O-ring grooves (including FKM & FFKM grooves) Low permeation Low out-gassing Low adhesion (reduced sticking) Low friction, high strength and high modulus make K13X ideal for constant force dynamic applications. Typical Applications Dynamic seals Static seals Wafer-handling products

Kimura® K23X

Polymer Name:Thermoplastic Elastomer (unspecified)
End Uses:Fittings, Electrical/Electronic Applications, Valve Parts, Valves
Features:Low Outgassing, High Performance, High Purity, Low CLTE

A brown colored high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for aggressive semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments.Kimura® K23X can be fully molded into custom shapes and O-rings (from 6.07mm/0.24" ID & 1.78mm/0.07" CS up to 600mm/23.6" ID & 10mm/0.39" CS).Key Attributes Exceptionally pure - does not contain any fillers which may cause particulation problems. Low modulus ensures excellent sealing characteristics Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries. Exceptionally low plasma etch rate Low thermal expansion Retro-fits existing O-ring grooves (including FKM & FFKM grooves) Low permeation Low out-gassing Low adhesion (reduced sticking) Typical Applications Dynamic seals Static seals Wafer-handling products

Kimura® K2CD

Polymer Name:Thermoplastic Elastomer (unspecified)
End Uses:Fittings, Electrical/Electronic Applications, Valve Parts, Valves
Features:Low Outgassing, High Performance, High Purity, Low Compression Set, Low CLTE

A red/brown high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for aggressive semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments.Key Attributes Exceptionally pure - does not contain any fillers which may cause particulation problems. Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries. Exceptionally low plasma etch rate Low thermal expansion Retro-fits existing O-ring grooves (including FKM & FFKM grooves) Low permeation Low out-gassing Low adhesion (reduced sticking) Typical Applications Dynamic seals Static seals Wafer-handling products

Knowde Brand Summary

Identification

Chemical Family: Fluoropolymers
Polymer Name: Perfluoroelastomer (FFKM),
Thermoplastic Elastomer (unspecified)
Technologies: Elastomers
Product Families: Specialty Elastomers
Fluoroelastomers,
Other Specialty Elastomers