A visibly clear and highly reinforced perfluoroelastomer, combining ultra- high purity with excellent mechanical properties. Developed for use in advanced wet and dry semiconductor processes down to the 45nm node and beyond, this material has ultra-low out-gassing properties, high temperature stability and excellent plasma resistance to provide effective sealing in extreme conditions.Perlast® G100XT combines a fully fluorinated polymer backbone with a highly fluorinated cross-linking system to provide a material with exceptional resistance to high temperature and aggressive semiconductor processes. The fully organic structure of the material helps to eliminate particles and reduce cost of ownership. The superior chemical performance of the material is enhanced by exceptionally low compression set, high elongation and ultimate tensile strength.Perlast® G100XT has a low modulus, giving it a very high sealing efficiency. The material is highly resistant to stress induced chemical attack in constant compression or constant strain environments, leading to longer service life and reliable sealing performance.Key Attributes Exceptionally pure - does not contain any inorganic fillers which may cause particulation problems. High temperature stability Exceptionally low compression set Excellent mechanical properties Ultra low out-gassing High sealing efficiency Reduced Cost of Ownership (CoO) Typical Applications Static Seals Wafer Handling Products
Polymer Name: Perfluoroelastomer (FFKM)
Features: Good Thermal Stability, Heat Resistance, High Elongation, High Purity, High Tensile Strength, Low Compression Set, Low Outgassing
