company tower banner
Reltek Company Logo

BONDiT™ B-4811

1 of 15 products in this brand
BONDiT™ B-4811 is a two-part, state-of-the-art 100% solids, room temperature curing rigid epoxy resin system, especially designed for potting, coating, and adhesive applications for electronics and electrical assemblies, environmental sealing, coating for corrosion resistance, bonding engineering plastics and elastomers to various substrates.

Product Type: 2K (2 component) Coating, Encapsulant, Potting Compound, Primer, Solventless & High Solids Coating

Cure Method: Air Dry, Heat Cure

Application Method: Brush, Spray

Compatible Substrates & Surfaces: Composites, Concrete, Elastomers & Rubbers, Glass, Metal, Plastics, Wood

Technical Data Sheet
  • TypeDocument Name
View All Documents

Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Product Info

B-4811 handles very harsh environments easily with outstanding effectiveness gainst moisture, salt water, acids, alkalies, oils, corrosive gasses and detergents.
B-4811 has high thermal stability, readily handling 200°C continuous and is rated for down hole oil and deepsea applications. B-4811 offers superior corrosion resistance. Likewise mechanical vibration, shock and impact are easily absorbed by B-4811 while protecting surfaces, bonded assemblies and encapsulated sensitive electronics. B-4811 is suitable for at least 500 cycles of autoclaving in medical applications.
This product used in conjunction with BONDiTTM A-3 affords exceptional corrosion protection for metal surfaces, especially in cathodic / anodic environments. BONDiTTM A-3/B-4811 to metal adhesion resists pH 11.0 levels at elevated temperatures of 95°C.
With excellent dielectric properties BONDiTTM B-4811 may be used as an electrical encapsulant, such as for back fill of electrical connectors and power components. It may then overmolded with urethanes, high temperature and pressure elastomeric molding, and thermoplastics molding.

Applications & Uses

Application Method
Curing Guide

A wide range of curing regimes may be employed: ambient set in 6 hours, tack free in 12 hours, and 95% cure in 24 hours; cure at 150°F—tack free in 2 hours,
98% in 4 hours; or 3 hours full cure at 200°F with no ambient incubation time.
Mix part A with part B, 2:1 ratio by volume or weight. Degasing is optional. Pot life is typically 40 minutes, at ambient temperature. Surface prep by abrading or grit blasting substrates with #100 AlOx followed by degrease and/or alcohol wipe.

High Chemical Resistance

A potting compound and coating for harsh environments. Superior chemical resistance for moisture and oil, acids and bases in continuous full submersion and autoclave (500 cycles). Highly stability to 200°C continuous. Superior for electrical potting applications.

Easy Use

Two part, primerless, semi-rigid epoxy, high tensile strength, ambient and thermal cure. Available in handheld and pneumatic gun actuated cartridges, quarts, gallons and drums.

Harsh Environments
"

Marine,Civil Engineering, Industrial, Downhole oil, Underwater, Mining, Industrial,, Automotive.

"

Technical Details & Test Data

Bonds Dissimilar Materials

An adhesive for bonding dissimilar materials such as plastics including UHMW, HDPE, PP, PET, PEEK, PPS, PBT, Acetal, ETFE, PVC, PVCF, PVDF, ABS, ECTFE, polyamide, polyimide rubber and urethane on metal, glass, composites, cement, and wood.

Storage & Handling

Storage

The usable shelf life of unopened containers of BONDiTTM B-4811 resin is one year stored in cool, dry place. Containers should be kept tightly closed.