Products

BONDiT™ B-482 is a two-part, state-of-the-art 100% solids, room-temperature curing flexible epoxy resin system. Especially designed for potting, coating, and adhesive applications for electronics and electrical assemblies, environmental sealing, hard coating for corrosion resistance, bonding engineering plastics and elastomers to various substrates.

BONDiT™ B-521 is a two-part, state-of-the-art 100% solids, elevated-temperature, fast curing, semi-flexible epoxy resin system. Especially designed for adhesive applications in bonding engineering plastics and elastomers to various substrates–particularly rigid substrates such as glass, metals and ceramic, without stress build up and joint or substrate fracture.

Sealitt™ A-46 is a high performance, high and low temperature one-part thin coat sealant and architectural clear coat for metals such as copper, stainless steel, aluminum, glass, ceramics, composites and plastics. A typical single coating of 0.002” (5mm) thick provides excellent corrosion protection, with a pinhole free coating in a single 0.002” thick application. Cop- per test plates, after 6 months exposure to heavy winter rains showed no signs of corrosion or loss of architectural quality and no degredation from sun exposure.

BONDiT™ B-536 is a two-part, very high strength, 100% solids, room-temperature curing semi-flexible epoxy resin system. Especially designed for adhesive applications in bonding to a wide range of engineering plastics, including polyolefin and metals, glass, ceramic, composite and wood. Typical example of lapshear bond strength is 1100 PSI for PEEK-to-PEEK and PEEK-to-Steel substrates. B-536 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, and detergents. B-536 has high thermal stability and offers good corrosion resistance. The semi- flexible properties of B-536 permits assembly of materials with dissimilar thermal expansion and survive thermal cycling. Likewise mechanical vibration, shock and impact are easily absorbed by B-536 and protect surfaces and bonded assemblies.

BONDiT™ B-4811 is a two-part, state-of-the-art 100% solids, room temperature curing rigid epoxy resin system, especially designed for potting, coating, and adhesive applications for electronics and electrical assemblies, environmental sealing, coating for corrosion resistance, bonding engineering plastics and elastomers to various substrates.

BONDiT™ B-755 is a unique low viscosity, two-part, high strength, 100% solids, room-temperature curing semi-rigid cyclo-aliphatic epoxy resin system with good scratch and impact resistance. Suitable for clear coat, conformal coating and electrical potting applications. The B-755 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, fuels, solvents and detergents. B-755 produces very low extract products in soak tests and provides corrosion resistance.